Film formation method and film formation apparatus
A film formation method is one for forming an organic layer comprising a fluorine-containing resin on an inorganic layer ( 3 ) formed on a substrate and comprising an inorganic substance. In the method, for the formation of the inorganic layer, a reactive sputtering procedure using water vapor as a reactive gas is carried out to form the inorganic layer on the substrate. Subsequently, the organic layer is formed on the inorganic layer. A film formation device enables the implementation of the film formation method.
1. A film formation method which comprises the step of forming an organic layer consisting of a fluorine-containing resin on an inorganic layer formed on a substrate to be processed and consisting of an inorganic material, wherein prior to forming the organic layer, the inorganic layer is formed on the substrate to be processed using the reactive sputtering technique using water vapor as a reactive gas and using Ar gas as an inert gas, wherein the flow rate of the Ar gas is 10 to 200 sccm and the flow rate of the water vapor is 100 to 400 sccm,
wherein the reactive sputtering technique comprises linking hydroxyl groups provided by the water vapor with a surface of the inorganic layer.
2. The film formation method as set forth in claim 1 , wherein the inorganic layer is a layer comprising at least one member selected from the group consisting of Si, Al, Ta, Nb, Ti, Zr, Sn, Zn, Mg and In.
3. The film formation method as set forth in claim 1 , wherein the inorganic layer is produced by forming at least two inorganic films in layers and wherein at least the upper most film among the inorganic films is formed according to the reactive sputtering technique while using water vapor as a reactive gas.
4. The film formation method as set forth in claim 1 , wherein the inorganic layer is formed by carrying out the reactive sputtering technique while using water vapor as a reactive gas and then carrying out a plasma treatment using water vapor.
5. The film formation method as set forth in claim 2 , wherein the inorganic layer is produced by forming at least two inorganic films in layers and wherein at least the upper most film among the inorganic films is formed according to the reactive sputtering technique while using water vapor as a reactive gas.
6. The film formation method as set forth in claim 2 , wherein the inorganic layer is formed by carrying out the reactive sputtering technique while using water vapor as a reactive gas and then carrying out a plasma treatment using water vapor.
7. The film formation method as set forth in claim 3 , wherein the inorganic layer is formed by carrying out the reactive sputtering technique while using water vapor as a reactive gas and then carrying out a plasma treatment using water vapor.
8. The method of claim 1 , wherein the flow rate of the Ar gas/the flow rate of the water vapor (Ar/H 2 O) is less than or equal to 33%.
9. The method of claim 1 , wherein forming the organic layer comprises formation of siloxane bonds between the fluorine-containing resin and the hydroxyl groups.