IP Library Granted Patent US 9,570,832
Granted Patent B2
US 9,570,832 · App. 14/662,591 · Granted Feb 14, 2017

Press-fit pin for semiconductor packages and related methods

Inventors: Chee Hiong Chew (Seremban, MY); Atapol Prajuckamol (Klaeng, TH); Yusheng Lin (Phoenix, AZ)
Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
H01R13/415H01R12/585H01R43/26
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Quick Facts
Patent No.
US 9,570,832
App. No.
14/662,591
Granted
Feb 14, 2017
Kind
B2
Abstract

A press-fit pin for a semiconductor package includes a shaft terminating in a head. A pair of arms extends away from a center of the head. Each arm includes a curved shape and the arms together form an s-shape. A length of the s-shape is longer than the shaft diameter. An outer extremity of each arm includes a contact surface configured to electrically couple to and form a friction fit with a pin receiver. In implementations the press-fit pin has only two surfaces configured to contact an inner sidewall of the pin receiver and is configured to contact the inner sidewall at only two locations. The shaft may be a cylinder. The s-shape formed by the pair of arms is visible from a view facing a top of the press-fit pin along a direction parallel with the longest length of the shaft. Versions include a through-hole extending through the head.

Claims (34)

1. A press-fit pin for a semiconductor package, comprising:

a shaft terminating in a head, and;

a pair of arms extending away from a center of the head, each arm comprising a curved shape, the pair of arms together forming an s-shape;

wherein a length of the s-shape is longer than a diameter of the shaft; and

wherein an outer extremity of each arm comprises a contact surface configured to electrically couple to and form a friction fit with a pin receiver.

2. The press-fit pin of claim 1 , wherein the press-fit pin comprises only two surfaces configured to contact an inner sidewall of the pin receiver.

3. The press-fit pin of claim 1 , wherein the press-fit pin is configured to contact an inner sidewall of the pin receiver at only two locations.

4. The press-fit pin of claim 1 , wherein the shaft comprises a cylinder.

5. The press-fit pin of claim 1 , wherein the s-shape formed by the pair of arms is visible from a view facing a top of the press-fit pin along a direction parallel with the longest length of the shaft.

6. The press-fit pin of claim 1 , wherein the head comprises a through-hole extending therethrough.

7. The press-fit pin of claim 6 , wherein the through-hole is accessible through two openings in a side surface of the head, each opening comprising a stadium shape.

8. The press-fit pin of claim 1 , wherein the s-shape is rotationally symmetric about a center of the shaft.

9. The press-fit pin of claim 1 , wherein the head forms a spiral shape.

10. A press-fit pin for a semiconductor package, comprising:

a shaft terminating in a head, and;

a pair of arms extending away from a center of the head, each arm comprising a curved shape, the pair of arms together forming an s-shape;

wherein an outer extremity of each arm comprises a contact surface configured to electrically couple to and form a friction fit with a pin receiver;

wherein a length of the s-shape is longer than a diameter of the shaft;

wherein the press-fit pin comprises only two surfaces configured to contact an inner sidewall of the pin receiver; and

wherein the s-shape is substantially rotationally symmetric about a center of the shaft.

11. The press-fit pin of claim 10 , wherein the press-fit pin is configured to contact the inner sidewall of the pin receiver at only two locations.

12. The press-fit pin of claim 10 , wherein the shaft comprises a cylinder.

13. The press-fit pin of claim 10 , wherein the head comprises a through-hole extending therethrough.

14. The press-fit pin of claim 13 , wherein the through-hole is accessible through two openings in a side surface of the head, each opening comprising a stadium shape.

15. A press-fit pin for a semiconductor package, comprising:

a shaft terminating in a head, and;

a plurality of arms extending away from a center of the head, each arm comprising a curved shape, the plurality of arms forming a shape that is rotationally symmetric about an axis of the shaft;

wherein a length of the shape is longer than a diameter of the shaft; and

wherein an outer extremity of each arm comprises a contact surface configured to electrically couple to and form a friction fit with a pin receiver.

16. The press-fit pin of claim 15 , wherein each arm forms a c-shape.

17. The press-fit pin of claim 15 , wherein the plurality of arms comprises only three arms extending away from the center of the head.

18. The press-fit pin of claim 15 , wherein the plurality of arms comprises only four arms extending away from the center of the head.

19. The press-fit pin of claim 18 , wherein the four arms form two s-shapes rotationally symmetric about the axis of the shaft.

20. The press-fit pin of claim 15 , wherein the plurality of arms comprises at least four arms extending away from the center of the head.

Assignments (4)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 19, 2015
From: CHEW, CHEE HIONG; PRAJUCKAMOL, ATAPOL; LIN, YUSHENG
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 035205/0151 →
Continuity (1)
Related Publication 20160276772A1 · Sep 22, 2016