STACKED INTERCONNECT HEAT SINK
A method is provided. The method includes providing an integrated circuit having a substrate. The method also includes locating a via within the substrate. The method further includes connecting the via to a corresponding heat spreader via. The corresponding heat spreader via may pass through a thermally conductive core of a heat spreader.
1 . A method of forming an electronic device, comprising:
providing an integrated circuit having a substrate;
locating an active via within said substrate; and
connecting said active via to a corresponding heat spreader via that passes through a thermally conductive core of a heat spreader.
2 . The method as recited in claim 1 , wherein said thermally conductive core is an electrically conductive layer.
3 . The method as recited in claim 2 , further comprising locating a dielectric layer between said heat spreader via and said thermally conductive core, and forming a solder pad on a surface of said thermally conductive core.
4 . The method as recited in claim 1 , wherein said thermally conductive core is an electrically insulating layer.
5 . The method as recited in claim 4 , further comprising forming a metallurgical connection between a heat spreader plug located within said electrically insulating layer with a substrate plug located within said substrate.
6 . The method as recited in claim 1 , further comprising locating a substrate plug within said substrate and connecting said substrate plug to said heat spreader.
7 . A method of forming an electronic device, comprising:
providing an integrated circuit having a substrate;
locating a via within said substrate; and
connecting said via to a corresponding heat spreader via that passes through a thermally conductive core of a heat spreader.
8 . The method as recited in claim 7 , wherein said thermally conductive core is an electrically conductive layer.
9 . The method as recited in claim 8 , further comprising locating a dielectric layer between said heat spreader via and said thermally conductive core, and forming a solder pad on a surface of said thermally conductive core.
10 . The method as recited in claim 7 , wherein said thermally conductive core is an electrically insulating layer.
11 . The method as recited in claim 10 , further comprising forming a metallurgical connection between a heat spreader plug located within said electrically insulating layer with a substrate plug located within said substrate.
12 . The method as recited in claim 7 , further comprising locating a substrate plug within said substrate and connecting said substrate plug to said heat spreader.
13 . A method, comprising:
providing an integrated circuit having a substrate;
locating a via within said substrate; and
connecting said via to a corresponding heat spreader via.
14 . The method as recited in claim 13 , wherein said corresponding heat spreader via passes through a thermally conductive core of a heat spreader.
15 . The method as recited in claim 14 , wherein said thermally conductive core is an electrically conductive layer.
16 . The method as recited in claim 15 , further comprising locating a dielectric layer between said heat spreader via and said thermally conductive core, and forming a solder pad on a surface of said thermally conductive core.
17 . The method as recited in claim 14 , wherein said thermally conductive core is an electrically insulating layer.
18 . The method as recited in claim 17 , further comprising forming a metallurgical connection between a heat spreader plug located within said electrically insulating layer with a substrate plug located within said substrate.
19 . The method as recited in claim 14 , further comprising locating a substrate plug within said substrate and connecting said substrate plug to said heat spreader.
20 . The method as recited in claim 13 , wherein said via is an active via.