Prototyping integrated circuit devices with programmable impedance elements

1. A method, comprising:

programming programmable resistive elements (PREs) in a first integrated circuit (IC) device to establish functions of configurable circuits of the first IC device; and

creating at least one second IC device by forming non-programmable connections based on resistive states of the PREs of the first IC device to provide the functions of the first IC device in the second IC device.

2. The method of claim 1 , wherein:

programming the PREs includes programming programmable metallization cells (PMCs).

3. The method of claim 1 , wherein:

creating the at least one second IC device includes forming an interconnect layer based on resistance states of the PREs of the first IC device.

4. The method of claim 3 , wherein:

programming the PREs includes programming PREs that are disposed between two different conductive patterns of the first IC device.

5. The method of claim 1 , wherein:

each of a plurality of the PREs is coupled to a programming voltage source by at least one corresponding access device.

6. The method of claim 1 , further including:

generating programming data corresponding to resistance states of the PREs of the first IC device; and

creating at least one interconnection mask for the at least one second IC device based on the programming data.

7. The method of claim 6 , wherein:

the at least one interconnection mask includes a mask of via locations corresponding to resistance states of the PREs.

8. A method, comprising:

programming programmable resistive elements (PREs) in a first integrated circuit (IC) device with first configuration data to establish functions of configurable circuits of the first IC device; and

if the first IC device provides a desired function after the programming, fabricating a second IC device with non-programmable interconnections derived from resistance states of the PREs of the first IC device.

9. The method of claim 8 , wherein:

if the first IC device does not provide the desired function after the programming, programming the PREs in the first IC device with second configuration data; and

determining if the first IC device provides the desired function.

10. The method of claim 8 , wherein:

fabricating the second IC device with non-programmable interconnections includes forming or not forming contacts or vias at locations according to resistance states of the PREs of the first IC device.

11. The method of claim 8 , wherein:

fabricating the second IC device with non-programmable interconnections includes forming or not forming interconnect segments according to resistance states of the PREs of the first IC device.

12. The method of claim 8 , wherein:

fabricating the first IC device, including

forming logic circuits in a substrate of the first IC device, and

forming a structure that interconnects the logic circuits of the first IC device with at least the PREs.

13. The method of claim 12 , wherein:

fabricating the second IC device includes

forming logic circuits in a substrate of the second IC device, and

forming a structure that interconnects the logic circuits of the second IC device based on states of the PREs of the first IC device.

14. The method of claim 8 , further including:

forming at least one IC fabrication mask corresponding to the states of the PREs of the first IC device; and

fabricating the second IC device using the at least one fabrication mask.

15. An integrated circuit (IC) device set, comprising:

at least a first IC device comprising first circuits configured to provide a predetermined function in response to states of first programmable resistive elements (PREs) formed over a substrate of the first IC device; and

at least a second IC device comprising second circuits configured to provide the predetermined function by a non-programmable interconnection structure; wherein

the non-programmable interconnect structure is based on resistive states of the first PREs.

16. The method of claim 15 , wherein:

the first and second circuits are logic circuits.

17. The method of claim 15 , wherein:

the first and second circuits are analog circuits.

18. The method of claim 15 , wherein:

the first IC device further includes a memory section that stores configuration data in second PREs; and

the first PREs are configured in response to the configuration data.

19. The method of claim 15 , wherein:

the first IC device further includes decode and program circuit configured to selectively apply programming conditions to the first PREs.

20. The method of claim 15 , wherein:

the first IC device further includes

a first conductive pattern,

a second conductive pattern formed over the first conductive pattern, and

first PREs formed between the first and second conductive patterns.