IP Library Granted Patent US 9,397,066
Granted Patent B2
US 9,397,066 · App. 14/693,881 · Granted Jul 19, 2016

Bond wire feed system and method therefor

Inventors: Zhijie Wang (Tianjin, CN); Zhigang Bai (Tianjin, CN); Huchang Zhang (Tianjin, CN)
Assignee: FREESCALE SEMICONDUCTOR, INC.
H01L24/78B23K20/005B23K31/12B23K37/047H01L2224/789H01L2224/78611H01L2224/78621H01L2224/78631
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Quick Facts
Patent No.
US 9,397,066
App. No.
14/693,881
Granted
Jul 19, 2016
Kind
B2
Abstract

A bond wire feed system has a wire tensioning unit with a chamber that has a wire inlet aperture and a wire outlet aperture. The wire inlet and outlet apertures have centers that are aligned with a central axis of the chamber. A clamp is positioned to receive a bond wire provided from the wire outlet aperture. The clamp has at least two jaws movable relative to each other and arranged to grip the wire to align a central axis of the wire with the central axis of the chamber. The jaws are also movable along the central axis of the wire in order to pull the wire through the wire tensioning unit.

Claims (25)

1. A wire feed system for a wire bonding machine, the system comprising:

a wire tensioning unit having a chamber with a wire inlet aperture and a wire outlet aperture with centers that are aligned with a central axis of the chamber; and

a clamp positioned to receive a bond wire provided from the wire outlet aperture, wherein the clamp has at least two jaws movable relative to each other and arranged to grip the wire to align a central axis of the wire with the central axis of the chamber, and wherein the jaws are movable along the central axis of the wire in order to pull the wire through the wire tensioning unit, wherein each of the jaws comprises two tapered surfaces to contact the bond wire at two tangent points in a cross-sectional view.

2. The wire feed system as claimed in claim 1 , wherein in the tapered surfaces for each jaw are planar surfaces which intersect along a line which is parallel to the central axis of the chamber.

3. The wire feed system as claimed in claim 1 , wherein each of the tapered surfaces has a curved surface.

4. The wire feed system as claimed in claim 1 further comprising a sensor located to detect the presence of the wire when protruding from the wire outlet aperture, wherein in operation when the presence of the wire is initially detected the clamp is actuated to grip the wire.

5. The wire feed system as claimed in claim 1 , further including a capillary welding tube with a capillary welding tube inlet and capillary welding tube outlet the centers of which are aligned with the central axis of the capillary tube.

6. The wire feed system as claimed in claim 5 , wherein in operation the wire is fed through the capillary tube as a result of the jaws gripping the wire and moving along the central axis.

7. The wire feed system as claimed in claim 6 , further including a current sensing circuit with two nodes, wherein in operation a first one of the nodes is in permanent electrical contact with the wire and a second one of the nodes is located to make electrical contact with the wire only when it protrudes through the capillary tube outlet.

8. The wire feed system as claimed in claim 7 , wherein in operation the second one of the nodes abuts a lead frame mounted on a wire bonding machine.

9. The wire feed system as claimed in claim 7 , further including a wire spooling unit that supplies the wire to the wire inlet aperture, wherein the first one of the two nodes in operation is located on the wire spooling unit.

10. A method of feeding a bond wire to a wire bonding machine, the method comprising:

feeding the bond wire through a wire tensioning unit having a chamber with a wire inlet aperture and a wire outlet aperture that have centers that are aligned with a central axis of the chamber;

clamping the bond wire with a clamp positioned to receive the bond wire provided from the wire outlet aperture, the clamp having at least two jaws movable relative to each other and arranged to grip the wire to align a central axis of the wire with the central axis of the chamber; and

moving the jaws along the central axis of the wire thereby pulling the wire through the wire tensioning unit, wherein each of the jaws comprises two tapered surfaces to contact the bond wire at two tangent points in a cross-sectional view.

11. The method of claim 10 , wherein the tapered surfaces for each jaw are planar surfaces which intersect along a line which is parallel to the central axis of the chamber.

12. The method of claim 10 , wherein each of the tapered surfaces has a curved surface.

13. The method of claim 10 , further comprising initially detecting the presence of the wire when protruding from the wire outlet aperture and in response thereto performing the clamping.

14. The method of claim 10 , wherein the moving provides for feeding the bond wire through a capillary welding tube.

15. The method of claim 14 , further including determining that an end section of the bond wire protrudes through an outlet of the capillary welding tube.

16. The method of claim 15 , wherein the determining comprises:

moving the capillary welding tube so that the outlet of the capillary welding tube is proximal to a contact area which is part of a current sensing circuit; and

detecting if a complete electrical circuit is formed by the end section of the bond wire contacting the contact area.

17. The method of claim 16 , wherein the contact area is part of a lead frame sheet.

18. The method of claim 16 , wherein if a complete electrical circuit is undetected the method controls the jaws to feed a length of the bond wire through the capillary welding tube.

Assignments (15)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040632 FRAME: 0001. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Sep 21, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 044209/0047 →
CHANGE OF NAME Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040632/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 20, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037565/0510 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 20, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037565/0527 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0859 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Aug 6, 2015
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 036284/0105 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Aug 6, 2015
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 036284/0363 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Aug 6, 2015
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 036284/0339 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 23, 2015
From: WANG, ZHIJIE; BAI, ZHIGANG; ZHANG, HUCHANG
To: FREESCALE SEMICONDUCTOR, INC
Reel/Frame 035485/0472 →
Priority Claims (1)
CN 2014 1 0858023 · Dec 1, 2014 · national
Continuity (1)
Related Publication 20160155718A1 · Jun 2, 2016