IP Library Granted Patent US 9,997,614
Granted Patent B2
US 9,997,614 · App. 14/694,929 · Granted Jun 12, 2018

Lateral transistors and methods with low-voltage-drop shunt to body diode

Inventors: Mohamed N. Darwish (Campbell, CA); Jun Zeng (Torrance, CA); Richard A. Blanchard (Los Altos, CA)
Assignee: MaxPower Semiconductor Inc.
H01L29/66734H01L21/26506H01L21/823412H01L21/823437H01L21/823475H01L21/823487H01L27/088H01L29/0878H01L29/1033H01L29/1095H01L29/16H01L29/36H01L29/407H01L29/41741H01L29/41766H01L29/4236H01L29/66727H01L29/7803H01L29/7813H01L29/7827H01L29/7831H01L29/7835H01L29/0623H01L29/0634H01L29/0847H01L29/42368H01L29/66666
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Quick Facts
Patent No.
US 9,997,614
App. No.
14/694,929
Granted
Jun 12, 2018
Kind
B2
Abstract

Methods and systems for power semiconductor devices integrating multiple quasi-vertical transistors on a single chip. Multiple power transistors (or active regions) are paralleled, but one transistor has a lower threshold voltage. This reduces the voltage drop when the transistor is forward-biased. In an alternative embodiment, the power device with lower threshold voltage is simply connected as a depletion diode, to thereby shunt the body diodes of the active transistors, without affecting turn-on and ON-state behavior.

Claims (11)

1. A power semiconductor device, comprising:

a first and a second laterally-gated transistor both having a first-conductivity-type source region, and a gate electrode which is capacitively coupled to a body region to selectably form a lateral channel therein, and a first-conductivity-type drain extension region laterally connecting said lateral channel to a vertically-extended conduction region extending from a single common drain region;

wherein the threshold voltage of said first laterally-gated transistor is lower than the threshold voltage of said second laterally-gated transistor;

wherein both said laterally-gated transistors are connected identically to a common source electrode, a common gate electrode, and a common drain electrode; and

wherein the width of the gate electrode of said first laterally-gated transistor is less than the width of the gate electrode of said second laterally-gated transistor.

2. The device of claim 1 , wherein both said gate electrodes are electrically separate portions of a single thin film layer.

3. The device of claim 1 , further comprising impurities implanted in the lateral channel of said first laterally-gated transistor which decrease the threshold voltage of said first laterally-gated transistor.

4. The device of claim 1 , wherein said laterally-gated transistors both have a first-conductivity-type source extension region laterally connecting said source region to said lateral channel.

5. The device of claim 1 , wherein said vertically-extended conduction regions are a single common region which laterally separates said first and second laterally-gated transistors.

6. The device of claim 1 , further comprising a shielding shape interposed between the gate electrodes of said first and second laterally-gated transistors.

7. The device of claim 1 , wherein said first conductivity type is N type.

Assignments (1)
SECURITY INTEREST Recorded Dec 27, 2022
From: MAXPOWER SEMICONDUCTOR, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 062228/0648 →
Continuity (3)
Continuation 13758703 · Feb 4, 2013
Provisional Application 61597979 · Feb 13, 2012
Related Publication 20150340360A1 · Nov 26, 2015