Semiconductor device package and method of manufacture
A structure to improve saw singulation quality and wettability of integrated circuit packages ( 140 ) is assembled with lead frames ( 112 ) having half-etched recesses ( 134 ) in leads. In one embodiment, the structure is a lead frame strip ( 110 ) having a plurality of lead frames. Each of the lead frames includes a depression ( 130 ) that is at least partially filled with a material ( 400 ) prior to singulating the lead frame strip. In another embodiment, the structure is a semiconductor device package ( 140 ) that includes a semiconductor device encapsulated in a package body ( 142 ) having a plurality of leads ( 120 ). Each lead has an exposed portion external to the package. There is recess ( 134 ) at a corner of each lead. Each recess has a generally concave configuration. Each recess is filled with a removable material ( 300 ).
1. A lead frame strip including a plurality of lead frames, comprising:
at least one elongated depression in a bottom surface of the lead frame strip, the at least one depression sized such that it does not cause an opening to occur between the bottom surface and a top surface of the lead frame strip, wherein the at least one elongated depression extends from a lead of a first lead frame to a lead of a second lead frame adjacent to the first lead frame and includes a portion of the lead frame strip between said lead frames; and
a material other than a solder wettable material disposed in the at least one elongated depression,
wherein the at least one elongated depression becomes, after singulation of the lead frame strip into individual lead frames, a recess at a corner of an end of a lead of at least one of the first lead frame and the second lead frame.
2. The lead frame strip of claim 1 , in which the material is a material from a group consisting of: an adhesive material, a thermoplastic material and a polymer material.
3. The lead frame strip of claim 2 , in which the material is the polymer material.
4. The lead frame strip of claim 3 , wherein the polymer material is a polyvinylpyrrolidone polymer, and wherein the polyvinylpyrrolidone polymer is one of rigid and at least semi-rigid after it is exposed to ultra-violent light.
5. The lead frame strip of claim 1 , wherein the material is soluble in water that is above room temperature.
6. The lead frame strip of claim 5 , in which the material is a thermosetting polymer material.
7. The lead frame strip of claim 1 , in which the material is polyimide.
8. The lead frame strip of claim 2 , wherein the material is fluidic when it is disposed in the at least one elongated depression, and wherein the material becomes one of rigid and at least semi-rigid prior to the singulation of the lead frame strip into individual lead frames.
9. The lead frame strip of claim 8 , wherein the material is fluidic when it is at a temperature higher than room temperature.
10. The lead frame strip of claim 8 , wherein the material is one of rigid and at least semi-rigid when it is at room temperature.
11. A semiconductor device package, comprising:
a semiconductor device encapsulated in a package body having a plurality of leads each lead having an exposed portion external to the package; and
a recess at a corner of at least one of the leads, the recess having a generally concave configuration,
wherein the recess is filled with a removable material selected from a group consisting of: an adhesive material, a thermoplastic material and a polymer material.
12. The semiconductor device package of claim 11 in which the removable material is the polymer material.
13. The semiconductor device package of claim 12 , wherein the polymer material is a polyvinylpyrrolidone polymer, and wherein the polyvinylpyrrolidone polymer is one of rigid and at least semi-rigid after it is exposed to ultra-violent light.
14. The semiconductor device package of claim 11 , wherein the removable material is soluble in water that is above room temperature.
15. The semiconductor device package of claim 14 , in which the removable material is a thermosetting polymer material.
16. The semiconductor device package of claim 11 , wherein the removable material is fluidic when it is disposed in the recess, and thereafter the material becomes one of rigid and semi-rigid.
17. The semiconductor device package of claim 11 , wherein the semiconductor device package is a QFN-style package.
18. A lead frame strip, comprising:
a plurality of lead frames at least one of which includes:
an outer frame structure defining a central opening;
a die pad disposed within the central opening; and
a plurality of leads attached to the outer frame and extending inward toward the die pad in spaced relation to each other,
wherein each lead of one lead frame extends outward from its die pad and is integral with a lead that extends outward from a die pad of an adjacent lead frame,
wherein each of the leads includes an elongated partially-etched depression having a middle portion and two end portions, each of the two end portions becoming, after singulation of the lead frame strip into individual lead frames, a recess at a corner of an end of a lead, and wherein the elongated partially-etched depression is filled with a non-wettable material prior to singulation.
19. The lead frame strip of claim 18 , wherein the non-wettable material is polyimide.
20. The lead frame strip of claim 18 , wherein the non-wettable material is a hot-water soluble material.