Method for selective re-routing of selected areas in a target layer and in adjacent interconnecting layers of an IC device
Methods for identification and partial re-routing of selected areas (e.g., including critical areas) in a layout of an IC design and the resulting device are disclosed. Embodiments include comparing design data of an IC device against criteria of manufacturing processes to manufacture the IC device; identifying in the design data a layout area based, at least in part, on proximity of metal segments, interconnecting segments, or a combination thereof in the layout area; performing partial re-routing in the layout area to substantially meet the criteria, wherein at least one interconnecting element is shifted or extended; and integrating the partial re-routing into the design data for use in the manufacturing processes.
1. A method comprising:
comparing design data of an integrated circuit (IC) device against criteria of manufacturing processes to manufacture the IC device;
identifying in the design data a layout area based, at least in part, on proximity of metal segments, interconnecting segments, or a combination thereof in the layout area;
performing partial re-routing in the layout area to substantially meet the criteria, wherein at least one interconnecting element is extended; and
integrating the partial re-routing into the design data for use in the manufacturing processes,
wherein the partial re-routing comprises:
a combination of forming a staircase-like extension on a portion of each of the metal segments in the critical area and a widening of the portion of each of the metal segments in the layout area, and the widening comprises:
diffusing the metal segments in a target layer and corresponding metal segment in adjacent layers in the layout area and adding new parallel sections along a linear edge of each of the diffused metal segments and the corresponding metal segments.
2. The method according to claim 1 , wherein the staircase-like extension comprises:
diffusing the metal segments in a target layer and corresponding metal segments in at least one adjacent layer in the layout area;
moving portions of the metal segments in opposite vertical directions to create a step difference along a linear edge of the metal segments and the corresponding metal segments; and
moving an interconnecting element, corresponding to each of the metal segments, aligned with a linear edge of each of the moved portions of the metal segments.
3. The method according to claim 2 , wherein parameters for the staircase-like extension and the widening are based, at least in part, on a percentage of a size of the metal segments and the corresponding metal segments.
4. The method according to claim 1 , wherein the criteria are associated with an optical proximity correction process.
5. The method according to claim 1 , wherein the criteria are associated with an electron beam writing process.
6. The method according to claim 1 , wherein the criteria include a minimum distance between connection points of the metal segments in adjacent layers, adjacent connecting metal and via layers, or a combination thereof.
7. The method according to claim 1 , wherein the target layer and the adjacent layer are created by a single or multiple patterning processes.
8. A method comprising:
comparing design data of an integrated circuit (IC) device against criteria of manufacturing processes to manufacture the IC device;
identifying in the design data a layout area based, at least in part, on proximity of metal segments, interconnecting segments, or a combination thereof in the layout area;
performing partial re-routing in the layout area to substantially meet the criteria by forming a staircase-like extension on a portion of each of the metal segments in the layout area and widening the portion of each of the metal segments in the layout area, wherein at least one interconnecting element is shifted or extended; and
integrating the partial re-routing into the design data for use in the manufacturing processes, wherein the widening comprises:
diffusing the metal segments in a target layer and corresponding metal segment in an adjacent layer in the layout area; and
adding new parallel sections along a linear edge of each of the diffused metal segments and the corresponding metal segments.
9. The method according to claim 8 , wherein the staircase-like extension comprises:
diffusing the metal segments in a target layer and corresponding metal segments in at least one adjacent layer in the layout area;
moving portions of the metal segments in opposite directions to create a step difference along a linear edge of the metal segments and the corresponding metal segments; and
moving an interconnecting element, corresponding to each of the metal segments, aligned with a linear edge of each of the moved portions of the metal segments.
10. The method according to claim 9 , wherein parameters for the staircase-like extension and the widening are based, at least in part, on a percentage of a size of the metal segments and the corresponding metal segments.
11. The method according to claim 8 , wherein the criteria are associated with an optical proximity correction process or an electron beam writing process.