Mobile electrostatic carrier for a semiconductive wafer and a method of using thereof for singulation of the semiconductive wafer
A mobile electrostatic carrier (MESC) provides a structural platform to temporarily bond a semiconductive wafer and can be used to transport the semiconductive wafer or be used to perform manufacturing processes on the semiconductive wafer. The MESC uses a plurality of electrostatic field generating (EFG) circuits to generate electrostatic fields across the MESC that allow the MESC to bond to compositional impurities within the semiconductive process. The MESC is particularly useful during singulation for a wafer fabrication process. The MESC holds the semiconductive wafer in a constant position as the semiconductive wafer is cut into a plurality of dies. Once the MESC is discharges its EFG circuits and consequently dissipates its bonding electrostatic fields, the plurality of dies can be easily and readily removed from the MESC.
1. A method of using a mobile electrostatic carrier for singulation of a semiconductive wafer, the method comprises the steps of:
providing said semiconductive wafer, wherein said semiconductive wafer is prepared for singulation during a wafer fabrication process;
providing said mobile electrostatic carrier, wherein said mobile electrostatic carrier includes a plurality of electrostatic field generating (EFG) circuits;
positioning said semiconductive wafer onto said mobile electrostatic carrier;
bonding said semiconductive wafer to said mobile electrostatic carrier by charging each of said plurality of EFG circuits;
cutting said semiconductive wafer into a plurality of dies as said semiconductor wafer is bonded onto said mobile electrostatic carrier;
debonding said plurality of dies from said mobile electrostatic carrier by discharging said plurality of EFG circuits; and
separating each of said plurality of dies off of said mobile electrostatic carrier.
2. The method of using a mobile electrostatic carrier for singulation of a semiconductive wafer, the method as claimed in claim 1 comprises the steps of:
providing an etching tool in order to cut said semiconductive wafer into said plurality of dies;
securing said mobile electrostatic carrier in place with said etching tool; and
etching a trench pattern into said semiconductive wafer with said etching tool as said mobile electrostatic carrier is secured in place by said etching tool, wherein said trench pattern delineates said plurality of dies.
3. The method of using a mobile electrostatic carrier for singulation of a semiconductive wafer, the method as claimed in claim 2 , wherein said etching tool is configured for deep reactive-ion etching.
4. The method of using a mobile electrostatic carrier for singulation of a semiconductive wafer, the method as claimed in claim 1 , a pick-and-place machine separates each of said plurality of dies from said mobile electrostatic carrier.
5. The method of using a mobile electrostatic carrier for singulation of a semiconductive wafer, the method as claimed in claim 1 comprises the steps of:
providing a positive pole and a negative pole for each of said plurality of EFG circuits;
positively charging said positive pole for each of the plurality of EFG circuits;
negatively charging said negative pole for each of the plurality of EFG circuits; and
producing an electrostatic field between said positive pole and said negative pole for each of said plurality of EFG circuits, wherein said electrostatic field bonds to compositional impurities within said semiconductive wafer.
6. The method of using a mobile electrostatic carrier for singulation of a semiconductive wafer, the method as claimed in claim 1 comprises the steps of:
wherein a polishing film is superimposed upon a planarized surface of said mobile electrostatic carrier; and
bonding said semiconductive wafer onto said mobile electrostatic carrier through intermolecular bonding between a flat surface of said semiconductive wafer and said polishing film of said mobile electrostatic carrier.