Electronic device including moat power metallization in trench
An electronic device is provided. The electronic device includes a semiconductor layer, a dielectric layer disposed on the semiconductor layer, circuitry disposed on the dielectric layer that includes interconnected cells, first contact line metallization and second contact line metallization, first power metallization disposed in-plane with or above the circuitry and second power metallization disposed in a trench defined in at least the dielectric layer. The electronic device further includes insulation disposed to insulate the second power metallization from the circuitry and the first power metallization at first locations and to permit electrical communication between the second power metallization, the circuitry and the first power metallization at second locations.
1. An electronic device, comprising:
a semiconductor layer;
a dielectric layer disposed on the semiconductor layer;
circuitry disposed on the dielectric layer and comprising interconnected cells, first contact line metallization and second contact line metallization;
first power metallization disposed in-plane with or above the circuitry;
second power metallization disposed in a trench defined in at least the dielectric layer; and
insulation disposed to insulate the second power metallization from the circuitry and the first power metallization at first locations and to permit electrical communication between the second power metallization, the circuitry and the first power metallization at second locations.
2. The electronic device according to claim 1 , herein the semiconductor layer comprises a silicon layer and the dielectric layer comprises a buried oxide (BOX) layer.
3. The electronic device according to claim 1 , wherein:
the first contact line metallization comprises source and drain contact (CA) line metallization,
the second contact line metallization comprises contact-to-gate (CB) line metallization,
the first power metallization comprises M1 metallization, and
the second power metallization comprises a moat power rail insulated from trench sidewalls.
4. The electronic device according to claim 3 , wherein the cells comprise front-end elements.
5. The electronic device according to claim 3 , wherein the first and second power metallization run perpendicular to the CA line metallization and parallel to the CB line metallization.
6. The electronic device according to claim 5 , wherein a portion of the CB line metallization runs over the insulation.
7. The electronic device according to claim 5 , wherein a portion of the CA line metallization runs partially across the insulation.
8. The electronic device according to claim 5 , wherein a portion of the CA line metallization runs entirely across the insulation.
9. The electronic device according to claim 5 , wherein the insulation is about 2.5 times a width of the CA and CB line metallization.
10. The electronic device according to claim 5 , wherein the M1 metallization comprises:
an M1 power rail extending in parallel with a portion of the moat power rail; and
a contact via extending from a lower surface of the M1 power rail.
11. The electronic device according to claim 1 , wherein the trench extends into the semiconductor layer.
12. The electronic device according to claim 1 , wherein the insulation comprises dielectric material formed to define vias at the second locations.
13. The electronic device according to claim 1 , further comprising additional power metallization disposed above and in electrical communication with the circuitry and the first power metallization.
14. An electronic device, comprising:
a silicon-on-insulator (SOI) substrate formed to define first and second trenches;
circuitry formed in an uppermost portion of the SOI substrate between the first and second trenches;
first power metallization disposed in-plane with or above the circuitry;
second power metallization disposed in the first and second trenches; and
insulation disposed to insulate the second power metallization from the circuitry and the first power metallization at first locations and to permit electrical communication between the second power metallization, the circuitry and the first power metallization at second locations.
15. The electronic device according to claim 14 , further comprising additional power metallization disposed above and in electrical communication with the circuitry and the first power metallization.
16. An electronic device, comprising:
a semiconductor layer;
a dielectric layer disposed on the semiconductor layer;
circuitry disposed on the dielectric layer and comprising:
interconnected cells;
first contact line metallization including source and drain contact (CA) line metallization; and
second contact line metallization including contact-to-gate (CB) line metallization;
first power metallization disposed in-plane with or above the circuitry, the first power metallization including M1 metallization;
second power metallization disposed in a trench defined in at least the dielectric layer, the second power metallization including a moat power rail insulated from trench sidewalls; and
insulation disposed to insulate the second power metallization from the circuitry and the first power metallization at first locations and to permit electrical communication between the second power metallization, the circuitry and the first power metallization at second locations.