Modeling localized temperature changes on an integrated circuit chip using thermal potential theory
View Patent ↗A temperature change of a device on an integrated circuit chip due to self-heating and thermal coupling with other device(s) is modeled considering inefficient heat removal from the backside of the chip. To perform such modeling, ratios of an imaginary heat amount to an actual heat amount for different locations on the IC chip must be predetermined using a test integrated circuit (IC) chip. During testing, one test device at one specific location on the test IC chip is selected to function as a heat source, while at least two other test devices at other locations on the test IC chip function as temperature sensors. The heat source is biased and changes in temperature at the heat source and at the sensors are determined. These changes are used to calculate the value of the imaginary heat amount to actual heat amount ratio to be associated with the specific location.
1. A method comprising:
providing a test integrated circuit chip in a package, the test integrated circuit chip comprising:
a substrate having a frontside and a backside opposite the frontside; and
test devices at different locations on the frontside,
selecting one of the test devices on the frontside of the substrate to be a heat source and others of the test devices to be sensors, the one of the test devices being at a specific location;
biasing the heat source using a supply voltage so as to heat the heat source above a nominal temperature;
during the biasing of the heat source, determining changes in temperature relative to the nominal temperature at the heat source and at the sensors;
based on the changes in temperature, determining a value of a ratio between a specific imaginary heat amount at a point off the backside of the substrate and an actual heat amount at the heat source, wherein the point off the backside of the substrate is aligned vertically with the specific location of the one of the test devices on the frontside of the substrate and wherein distances between the backside of the substrate and the point and between the backside of the substrate and the specific location are equal; and,
storing, in memory, the value of the ratio, the value of the ratio being associated with the specific location and being stored so as to be available for use in generating thermal models of localized temperature changes on a functional integrated circuit chip.
2. The method of claim 1 , the determining of the changes in temperature relative to the nominal temperature of the heat source and of the sensors comprising measuring a performance attribute indicative of temperature.
3. The method of claim 1 , further comprising, during the biasing of the heat source with the supply voltage, biasing the sensors with a second supply voltage, the second supply voltage being less than the supply voltage and further being sufficiently low to avoid self heating of the sensors above the nominal temperature.
4. The method of claim 1 , the determining of the value of the ratio comprising:
plotting data indicating a relationship between changes in temperatures at the sensors and distances between the heat source and the sensors, respectively;
finding a curve for the following equation that fits the data:
Δ
T
=
Q
*
(
1
r
1
+
X
r
1
2
+
4
*
t
2
)
,
where ΔT represents a change in temperature at a temperature sensor, Q represents an amount of heat at the heat source, r 1 represents a distance between the heat source and the temperature sensor, t represents a thickness of a substrate and X represents the value of the ratio; and, based on the curve, determining the value of the ratio.
5. The method of claim 1 , further comprising repeating the selecting, the biasing, the determining of the changes in the temperature and the determining of the specific imaginary heat amount for each of the test devices at the different locations.