IP Library Granted Patent US 10,288,645
Granted Patent B2
US 10,288,645 · App. 14/755,733 · Granted May 14, 2019

Organic probe substrate

Inventors: David M. Audette (Colchester, VT); Sukjay J. Chey (Hartsdale, NY); Steven A. Cordes (Yorktown Heights, NY); Anthony D. Fortin (Shelburne, VT); David L. Gardell (Fairfax, VT); John R. Maher (Essex Junction, VT); Sankeerth Rajalingam (Peekskill, NY); Frederick H. Roy, III (Williston, VT)
Assignee: GLOBALFOUNDRIES INC.
G01R3/00G01R1/07378G01R31/2886
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Quick Facts
Patent No.
US 10,288,645
App. No.
14/755,733
Granted
May 14, 2019
Kind
B2
Abstract

An organic probe substrate structure includes a daughter card; an organic laminate attached to the daughter card; and multiple probes built onto a top surface of the organic laminate.

Claims (28)

1. An organic probe substrate structure comprising:

a daughter card including a plurality of through vias on a first pitch;

an organic laminate attached to the daughter card via a plurality of solder connections; and

a plurality of probes built directly onto a top planar surface of the organic laminate;

wherein the organic laminate includes a plurality of probe vias on a second pitch connected to a plurality of connecting vias on a third pitch by a bridge, the connecting vias contacting the plurality of solder connections,

the first pitch is the same as the third pitch, and the second pitch is less than the first pitch and the third pitch,

the plurality of probes electrically contact the through vias through the plurality of probe vias, the bridge, the connecting vias, and a plurality of balls, and

the daughter card includes a ledge on each side, each of which includes a fastening hole, wherein when mounted, the structure is unsupported at corners of the structure.

2. The structure of claim 1 , wherein the plurality of solder connections are provided between the organic laminate and the daughter card.

3. The structure of claim 2 , further comprising filling material provided in between the daughter card and the organic laminate and around the plurality of solder connections.

4. The structure of claim 2 , wherein

the plurality of probes are built on the plurality of probe vias.

5. The structure of claim 1 , wherein the daughter card is organic.

6. The structure of claim 1 , wherein the plurality of probes are built directly onto the top planar surface of the organic laminate.

7. The structure of claim 1 , wherein the plurality of probes are built above a respective plurality of probe vias.

8. The structure of claim 7 , wherein the respective plurality of probe vias are connected to a plurality of connecting vias by a bridge.

9. An organic probe substrate structure comprising:

a daughter card having a plurality of through vias on a first pitch;

a plurality of balls attached to the daughter card at the plurality of through vias;

an organic laminate having a plurality of connecting vias on the first pitch on a bottom surface of the organic laminate, the plurality of balls attached to the organic laminate at the plurality of connecting vias, the organic laminate further comprising a plurality of probe vias on a second pitch on a top surface of the organic laminate and connected to the connecting vias on a third pitch by a bridge, the first pitch being the same as the third pitch, and the second pitch being less than the first pitch and the third pitch; and

a plurality of probes built onto the plurality of probe vias and directly on a top planar surface of the organic laminate,

wherein the through vias, the connecting vias, the bridge, and the probe vias each comprise a conductive material,

wherein the plurality of probes electrically contact the through vias through the plurality of probe vias, the bridge, the connecting vias, and the plurality of balls, and

wherein the daughter card includes a ledge on each side, each of which includes a fastening hole, wherein when mounted, the structure is unsupported at corners of the structure.

10. The structure of claim 9 , wherein the daughter card is organic.

11. The structure of claim 9 , wherein the plurality of probes are built onto a planar surface.

12. The structure of claim 11 , wherein the plurality of probes are built directly onto the planar surface.

13. The structure of claim 9 , wherein the plurality of through vias are within the daughter card.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 2, 2020
From: GLOBALFOUNDRIES INC.
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 054633/0001 →
SECURITY AGREEMENT Recorded Nov 29, 2018
From: GLOBALFOUNDRIES INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 049490/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 8, 2016
From: GLOBALFOUNDRIES U.S. 2 LLC
To: GLOBALFOUNDRIES INC.
Reel/Frame 038224/0720 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 10, 2016
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 037941/0684 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2015
From: AUDETTE, DAVID M.; CHEY, SUKJAY J.; CORDES, STEVEN A.; FORTIN, ANTHONY D.; GARDELL, DAVID L.; MAHER, JOHN R.; RAJALINGAM, SANKEERTH; ROY, FREDERICK H., III
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 035958/0448 →
Continuity (1)
Related Publication 20170003318A1 · Jan 5, 2017