Reclaimable semiconductor device package and associated systems and methods
Several embodiments of reclaimable semiconductor device packages and assemblies are disclosed herein. A semiconductor device assembly ( 100 ) includes a package ( 101 ) having a housing ( 102 ) and a package contact ( 104 ) arranged to receive a signal indicative of a reclamation state. A plurality of modules of semiconductor dies ( 106 ) are located within the housing and electrically coupled to the package contact ( 104 ). The dies ( 106 ) of the first and second modules dies are configured to store a module configuration state. The first and second modules ( 107 a, 107 b ) are enabled for operation based, at least in part, on the reclamation state and the module configuration state.
1. A semiconductor device assembly, comprising:
a package having a housing and a package contact arranged to receive a signal indicative of a reclamation state;
a first module of a first plurality of semiconductor dies within the housing and electrically coupled to the package contact, wherein the individual first semiconductor dies are configured to store a configuration state;
a second module of a second plurality of semiconductor dies within the housing and electrically coupled to the package contact, wherein the individual second semiconductor dies are configured to store the configuration state; and
a support substrate having a first contact arranged to provide a first signal during operation, and a second contact arranged to provide a second signal during operation, wherein:
both the first and second modules of semiconductor dies are enabled for operation when the package contact is electrically coupled to the first contact and not to the second contact; and
the first module and the second module of semiconductor dies are disabled based on the configuration state when the package contact is electrically coupled to the second contact and not to the first contact.
2. The semiconductor device assembly of claim 1 wherein:
the first signal has different logic levels during operation; and
the second signal has generally the same logic level during operation.
3. The semiconductor device assembly of claim 1 , wherein the package contact is configured to be selectively electrically coupled to the first contact or the second contact by a conductive jumper.
4. The semiconductor device assembly of claim 1 , wherein the first and second individual semiconductor dies further include a programmable component that stores the configuration state.
5. The semiconductor device assembly of claim 4 , wherein the programmable component comprises an electronic fuse.
6. The semiconductor device assembly of claim 1 , wherein the signal indicative of a reclamation state comprises a first state signal, and wherein the first and second individual semiconductor dies further include a logic component configured to provide a second state signal based on the reclamation state and the configuration state.
7. The semiconductor device of claim 6 , wherein the logic component is arranged to provide the second state signal by inverting the first state signal based on the configuration state.
8. The semiconductor device assembly of claim 1 , wherein the individual first and second semiconductor dies are configured to be disabled based, at least in part, on the reclamation state and the configuration state.
9. The semiconductor device of claim 1 , wherein the individual first and second semiconductor dies include a memory component that is configured to be disabled based, at least in part, on the reclamation state and the configuration state.
10. The semiconductor device assembly of claim 1 , wherein the first and second individual semiconductor dies include a NOR or a NAND based memory component.
11. The semiconductor device assembly of claim 1 , wherein the first and second individual semiconductor dies include flash memory, dynamic random access memory (DRAM), or static random access memory (SRAM).