Substrate processing apparatus, recording medium and method of manufacturing semiconductor device
A substrate processing apparatus includes first and second process chambers; a mounting section on which a housing vessel that houses the substrate is mounted; a vacuum transfer chamber that has a vacuum transfer machine to transfer the substrate under a negative pressure; and an atmospheric transfer chamber that has an atmospheric transfer machine that transfers the substrate under an atmospheric pressure. Timing for the atmospheric transfer chamber to take out the substrate from the housing vessel is based on a recipe remaining time, which is a remaining time of substrate processing, and an approach time, which is a time from when the substrate is taken out from the housing vessel till when the substrate is mounted to the vacuum transfer machine.
1. A substrate processing apparatus comprising:
a plurality of process chambers that process a substrate;
a mounting section on which one or more housing vessels, that house the substrate, is mounted;
a vacuum transfer chamber that has a vacuum transfer machine to transfer the substrate under a negative pressure;
an atmospheric transfer chamber that has an atmospheric transfer machine to transfer the substrate under an atmospheric pressure; and
a control section that determines a timing for the atmospheric transfer machine to take out the substrate from the housing vessel based on a recipe remaining time, which is a remaining time of substrate processing in each of the plurality of process chambers, and an approach time, which is a time from when the substrate is taken out from the housing vessel till when the substrate is mounted to the vacuum transfer machine, when the substrate is transferred from the housing vessel to a predetermined process chamber among the process chambers after the substrate is transferred to the plurality of process chambers from the housing vessel mounted to the mounting section via the atmospheric transfer chamber and the vacuum transfer chamber and the substrate processing is started in the plurality of process chambers.
2. The substrate processing apparatus according to claim 1 , the apparatus further comprising:
a cooling chamber that of switches a negative pressure state and an atmospheric pressure state, and cools a processed substrate transferred from the plurality of process chambers,
wherein the control section controls the cooling chamber to be the negative pressure from the atmospheric pressure based on a recipe remaining time, which is a remaining time of the substrate processing in the process chamber other than the predetermined process chamber, and a cooling remaining time, which is a remaining time of substrate cooling in the cooling chamber, when the processed substrate is unloaded from the process chamber other than the predetermined process chamber after unloading the processed substrate from the predetermined process chamber.
3. The substrate processing apparatus according to claim 2 ,
wherein the control section controls the cooling chamber to be the negative pressure from the atmospheric pressure when the recipe remaining time is equal to or less than the cooling remaining time.
4. The substrate processing apparatus according to claim 2 ,
wherein the control section controls the cooling chamber to be the negative pressure from the atmospheric pressure based on a processing and unloading time, which is a total time of the recipe remaining time and a processed substrate unloading time as a time required for unloading the processed substrate from the predetermined process chamber, and a cooling and evacuation time, which is a total time of the cooling remaining time, a cooled substrate unloading time as a time required for unloading a cooled substrate from the cooling chamber, and an evacuation time as a time required for the cooling chamber to be at the negative pressure from the atmospheric pressure.
5. The substrate processing apparatus according to claim 4 ,
wherein the control section controls the cooling chamber to be at the negative pressure from the atmospheric pressure when the processing and unloading time is equal to or less than the cooling and evacuation time.
6. The substrate processing apparatus according to claim 1 ,
wherein the control section delays a timing for the atmospheric transfer machine to take out an unprocessed substrate from the substrate housing vessel until the unloading of the processed substrate ends when the processed substrate is unloaded from the predetermined process chamber.
7. The substrate processing apparatus according to claim 1 ,
wherein the control section controls the atmospheric transfer machine to take out the substrate from the housing vessel when the recipe remaining time is equal to or less than the approach time.
8. A non-transitory computer-readable recording medium in which a program is recorded to be readable, the program to be executed by a substrate processing apparatus, the substrate processing apparatus including:
a plurality of process chambers that process a substrate;
a vacuum transfer chamber that has a vacuum transfer machine to transfer the substrate under a negative pressure;
an atmospheric transfer chamber that has an atmospheric transfer machine to transfer the substrate under an atmospheric pressure; and
a control section that transfers the substrate to the process chamber via the atmospheric transfer chamber and the vacuum transfer chamber,
the program causing the control section to execute a timing determination step of determining a timing for the atmospheric transfer machine to take out the substrate from the housing vessel based on a recipe remaining time, which is a remaining time of substrate processing in a predetermined process chamber, and an approach time, which is a time until the substrate is mounted to the vacuum transfer machine, when the substrate is transferred to the predetermined process chamber after starting the substrate processing in the plurality of process chambers.
9. The non-transitory computer-readable recording medium in which a program is recorded to be readable according to claim 8 ,
the program to be executed by the substrate processing apparatus further including a cooling chamber that cools the processed substrate transferred from the process chamber,
the program causing the control section to execute: a cooling chamber reduced pressure step of setting the cooling chamber to be the negative pressure from the atmospheric pressure based on a recipe remaining time, which is a remaining time of the substrate processing in the process chamber other than the predetermined process chamber, and a cooling remaining time, which is a remaining time of substrate cooling in the cooling chamber, when the processed substrate is unloaded from the process chamber other than the predetermined process chamber after unloading the processed substrate from the predetermined process chamber; and a substrate cooling step of cooling the processed substrate unloaded from the plurality of process chambers.
10. A method of manufacturing semiconductor device, the method comprising:
a substrate transfer step of transferring a substrate to a plurality of process chambers that process the substrate via an atmospheric transfer chamber to which the substrate is transferred under an atmospheric pressure and an vacuum transfer chamber to which the substrate is transferred under a negative pressure;
a substrate processing step of performing a predetermined processing to the substrate in the plurality of process chambers; and
a timing determination step of determining a timing for the atmospheric transfer machine to transfer the substrate based on a recipe remaining time, which is a remaining time of substrate processing in each of the plurality of process chambers, and an approach time, which is a time until the substrate is mounted to the vacuum transfer machine, when the substrate is transferred to a predetermined process chamber among the plurality of process chambers after starting the substrate processing in the plurality of process chambers.
11. The method of manufacturing semiconductor device according to claim 10 , the method further comprising:
a cooling chamber reduced pressure step of setting the cooling chamber to be the negative pressure from the atmospheric pressure based on a recipe remaining time, which is a remaining time of substrate processing in the process chamber other than the predetermined process chamber among the plurality of process chambers, and a cooling remaining time, which is a remaining time of substrate cooling in the cooling chamber, when the processed substrate is unloaded from the process chamber other than the predetermined process chamber among the plurality of process chambers after unloading the processed substrate from the predetermined process chamber; and
a substrate cooling step of cooling the processed substrate unloaded from the plurality of process chambers.