IP Library Granted Patent US 9,419,056
Granted Patent B2
US 9,419,056 · App. 14/794,162 · Granted Aug 16, 2016

Resistive memory cell structures and methods

Inventors: Fabio Pellizzer (Boise, ID); Ferdinando Bedeschi (Biassono, IT)
Assignee: Micron Technology, Inc.
H01L27/2463H01L45/06H01L45/126H01L45/1233H01L45/1286H01L45/144H01L45/16H01L45/165H01L45/1675H01L45/1683
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Quick Facts
Patent No.
US 9,419,056
App. No.
14/794,162
Granted
Aug 16, 2016
Kind
B2
Abstract

Resistive memory cell structures and methods are described herein. One or more memory cell structures comprise a first resistive memory cell comprising a first resistance variable material and a second resistive memory cell comprising a second resistance variable material that is different than the first resistance variable material.

Claims (14)

1. An array of resistive memory cells, comprising:

a first number of resistive memory cells, each including a self-aligned structure, in a first region of the array and comprising:

a first select device;

a first conductive plug coupled to the first select device;

a first heater material formed on the first conductive plug; and

a resistance variable material coupled to the first heater material and having a particular electrothermal property associated therewith;

a second number of resistive memory cells, each including a self-aligned structure, in a second region of the array and comprising:

a second select device;

a second conductive plug coupled to the second select device;

a second heater material formed on the second conductive plug; and

a resistance variable material coupled to the second heater material and having a different electrothermal property associated therewith;

a first reactant material formed on the resistance variable material in the first region; and

a metal second reactant material different than the first reactant material formed on the first reactant material in the first region and the resistance variable material in the second region,

wherein the first and the second reactant materials have different thicknesses.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2015
From: PELLIZZER, FABIO; BEDESCHI, FERDINANDO
To: MICRON TECHNOLOGY, INC.
Reel/Frame 036025/0099 →
Continuity (2)
Division 13352680 · Jan 18, 2012
Related Publication 20150333104A1 · Nov 19, 2015