Silicon carbide semiconductor device
A silicon carbide semiconductor device includes: a silicon carbide semiconductor layer; and an electrode layer in contact with the silicon carbide semiconductor layer. In a case where the electrode layer is equally divided into two in a thickness direction in one cross section of the electrode layer in the thickness direction to obtain a first region facing the silicon carbide semiconductor layer and a second region opposite to the silicon carbide semiconductor layer, an area of a carbon portion containing the carbon in the first region is wider than an area of the carbon portion in the second region. At an interface region located up to 300 nm from an interface between the silicon carbide semiconductor layer and the electrode layer, the carbon portion includes a plurality of portions disposed with a space interposed therebetween, and a ratio of area occupied by the carbon portion is not more than 40%.
1. A silicon carbide semiconductor device comprising:
a silicon carbide semiconductor layer; and
an electrode layer in contact with said silicon carbide semiconductor layer,
at least a portion of said electrode layer containing carbon,
in a case where said electrode layer is equally divided into two in a thickness direction in one cross section of said electrode layer in the thickness direction to obtain a first region facing said silicon carbide semiconductor layer and a second region opposite to said silicon carbide semiconductor layer, an area of a carbon portion containing said carbon in said first region being wider than an area of said carbon portion in said second region,
in said one cross section at an interface region located up to 300 nm from an interface between said silicon carbide semiconductor layer and said electrode layer, said carbon portion including a plurality of portions disposed with a space interposed therebetween, a ratio of area occupied by said carbon portion being not more than 40%.
2. The silicon carbide semiconductor device according to claim 1 , wherein said electrode layer contains nickel.
3. The silicon carbide semiconductor device according to claim 2 , wherein
said electrode layer further contains silicon, and
in a total of the number of atoms of nickel and silicon in said electrode layer, a ratio of the number of atoms of nickel is not less than 68 atomic % and not more than 75 atomic %.