Method of manufacturing semiconductor device including forming a film containing a first element, a second element and carbon, substrate processing apparatus, and recording medium

1. A method of manufacturing a semiconductor device, comprising forming a film containing a first element, a second element and carbon on a substrate by performing a cycle a predetermined number of times, the cycle including non-simultaneously performing:

supplying a carbon-free first precursor to the substrate to form a seed layer that has a thickness of one atomic layer or more and contains the first element, wherein the first precursor includes chemical bonds between atoms of the first element;

supplying a second precursor to the substrate to form a first layer containing the first element and carbon on the seed layer, wherein the second precursor includes chemical bonds between the first element and carbon without having the chemical bonds between atoms of the first element, wherein the second precursor contains the first element, carbon and a halogen element; and

supplying a first reactant containing the second element to the substrate to modify the seed layer and the first layer into a second layer, wherein the second layer contains the first element, the second element and carbon,

wherein a carbon concentration in the second layer is controlled by:

increasing a ratio of the thickness of the seed layer to a thickness of a laminated layer of the seed layer and the first layer so as to decrease the carbon concentration in the second layer; and

increasing a ratio of the thickness of the laminated layer of the seed layer and the first layer to the thickness of the seed layer so as to increase the carbon concentration in the second layer.

2. The method of claim 1 , wherein the cycle is performed the predetermined number of times under a condition in which at least some of the chemical bonds between the first element and carbon contained in the second precursor are maintained.

3. The method of claim 1 , wherein the supplying the second precursor is performed under a condition in which at least some of the chemical bonds between the first element and carbon contained in the second precursor are maintained without being broken.

4. The method of claim 1 , wherein the supplying the first reactant is performed under a condition in which at least some of the chemical bonds between the first element and carbon contained in the first layer are maintained without being broken.

5. The method of claim 1 , wherein the cycle is performed the predetermined number of times under a condition in which the second precursor is pyrolyzed and at least some of the chemical bonds between the first element and carbon contained in the second precursor are maintained.

6. The method of claim 1 , wherein a space in which the substrate exists is purged between the supplying the first precursor and the supplying the second precursor.

7. The method of claim 1 , wherein a supply amount of the first precursor is set greater than a supply amount of the second precursor.

8. The method of claim 1 , wherein a supply flow rate of the first precursor is set greater than a supply flow rate of the second precursor.

9. The method of claim 1 , wherein a supply time of the first precursor is set longer than a supply time of the second precursor.

10. The method of claim 1 , wherein the cycle further includes performing supplying a second reactant containing a third element to the substrate, and

the film further containing the third element is formed on the substrate by performing the cycle the predetermined number of times.

11. The method of claim 1 , wherein the first precursor contains the first element and a halogen element.

12. The method of claim 1 , wherein the second precursor has at least two chemical bonds between the first element and carbon in one molecule.

13. The method of claim 1 , wherein the first reactant includes at least one selected from a group consisting of a nitrogen-containing gas, a carbon-containing gas, a nitrogen- and carbon-containing gas, an oxygen-containing gas, a boron-containing gas and a boron-, nitrogen- and carbon-containing gas.

14. A non-transitory computer-readable recording medium storing a program that causes a computer to perform a process of forming a film containing a first element, a second element and carbon on a substrate by performing a cycle a predetermined number of times, the cycle including non-simultaneously performing:

supplying a carbon-free first precursor to the substrate to form a seed layer that has a thickness of one atomic layer or more and contains the first element, wherein the first precursor includes chemical bonds between atoms of the first element;

supplying a second precursor to the substrate to form a first layer containing the first element and carbon on the seed layer, wherein the second precursor includes chemical bonds between the first element and carbon without having the chemical bonds between atoms of the first element; and

supplying a reactant containing the second element to the substrate to modify the seed layer and the first layer into a second layer, wherein the second layer contains the first element, the second element and carbon,

wherein a carbon concentration in the second layer is controlled by:

increasing a ratio of the thickness of the seed layer to a thickness of a laminated layer of the seed layer and the first layer so as to decrease the carbon concentration in the second layer; and

increasing a ratio of the thickness of the laminated layer of the seed layer and the first layer to the thickness of the seed layer so as to increase the carbon concentration in the second layer.