Zener diode devices and related fabrication methods
Zener diode structures and related fabrication methods and semiconductor devices are provided. An exemplary semiconductor device includes first and second Zener diode structures. The first Zener diode structure includes a first region, a second region that is adjacent to the first region, and a third region adjacent to the first region and the second region to provide a junction that is configured to influence a first reverse breakdown voltage of a junction between the first region and the second region. The second Zener diode structure includes a fourth region, a fifth region that is adjacent to the fourth region, and a sixth region adjacent to the fourth region and the fifth region to provide a junction configured to influence a second reverse breakdown voltage of a junction between the fourth region and the fifth region, wherein the second reverse breakdown voltage and the first reverse breakdown voltage are different.
1. A diode comprising:
a first region having a first conductivity type;
a second region having a second conductivity type, the first region overlying the second region and the second region being adjacent to the first region to provide a vertical junction between the first region and the second region; and
a third region adjacent to the first region and the second region to provide a lateral junction between the third region and one of the first region or the second region, wherein:
the lateral junction influences a first reverse breakdown voltage of the vertical junction; and
a second reverse breakdown voltage of the lateral junction is greater than the first reverse breakdown voltage of the vertical junction.
2. The diode of claim 1 , wherein the lateral junction is angled with respect to the vertical junction.
3. The diode of claim 2 , wherein the lateral junction is substantially orthogonal to the vertical junction.
4. The diode of claim 1 , wherein the third region has the second conductivity type to provide the lateral junction between the third region and the first region.
5. The diode of claim 4 , wherein a dopant concentration of the third region is less than a second dopant concentration of the second region.
6. The diode of claim 4 , wherein a second dopant concentration of the second region is greater than a first dopant concentration of the first region.
7. The diode of claim 1 , wherein the third region has the first conductivity type to provide the lateral junction between the third region and the second region.
8. The diode of claim 7 , wherein a first dopant concentration of the first region is greater than a second dopant concentration of the second region.
9. The diode of claim 7 , wherein a third dopant concentration of the third region is greater than a first dopant concentration of the first region.
10. The diode of claim 7 , wherein:
the first region comprises an anode region;
the second region comprises a cathode region; and
the third region comprises an anode enhancement region.
11. The diode of claim 1 , wherein the third region laterally circumscribes the first region and the second region.
12. The diode of claim 1 , wherein a lateral dimension of one of the first region and the second region is different from that lateral dimension of the third region.
13. A diode comprising:
an anode region having a first conductivity type;
a cathode region having a second conductivity type, the cathode region being adjacent to the anode region to provide a first junction between the anode region and the cathode region; and
a third region adjacent to the anode region and the cathode region to provide a second junction between the third region and one of the anode region or the cathode region, wherein the second junction is configured to increase a reverse breakdown voltage of the first junction by increasing a width of a depletion region associated with the first junction within the one of the anode region or the cathode region.
14. The diode of claim 13 , wherein:
the first junction comprises a vertical junction between the anode region and the cathode region;
the second junction comprises a lateral junction between the third region and the one of the anode region or the cathode region; and
the lateral junction influences a reverse breakdown voltage of the vertical junction.
15. The diode of claim 13 , wherein:
the first junction comprises a lateral junction between the anode region and the cathode region;
the second junction comprises a vertical junction between the third region and the one of the anode region or the cathode region; and
the vertical junction influences a reverse breakdown voltage of the lateral junction.
16. The diode of claim 13 , wherein a dopant concentration of the third region is greater than a dopant concentration of the one of the anode region or the cathode region.
17. The diode of claim 13 , wherein the third region has the second conductivity type to provide the second junction between the third region and the anode region.
18. The diode of claim 13 , wherein the third region has the first conductivity type to provide the second junction between the third region and the cathode region.
19. A method of fabricating a diode structure on a semiconductor substrate, the method comprising:
forming a first region in the semiconductor substrate, the first region having a first conductivity type;
forming a second region in the semiconductor substrate adjacent to the first region, the second region having a second conductivity type to provide a first junction between the first region and the second region; and
forming a third region in the semiconductor substrate adjacent to the first region and the second region, the third region providing a second junction between the third region and one of the first region or the second region that influences a reverse breakdown voltage of the first junction.
20. The method of claim 19 , wherein forming the third region comprises implanting ions having a dopant concentration that is greater than a dopant concentration of the one of the first region or the second region.