Die bonding to a board
A method of bonding a plurality of die having first and second metal layers on a die surface to a board, comprising placing a first die onto a board comprising one of a ceramic or substrate board or metal lead frame having a solderable surface and placing the first die and the board into a reflow oven. The method includes reflowing at a first reflow temperature for a first period until the first metal board layer and at least one of the first and second metal die layers of the first die form an alloy to adhere the first die to the board. The alloy has a melting temperature higher than the first reflow temperature. Accordingly, additional die may be added at a later time and reflowed to attach to the board without causing the bonding of the first die to the board to fail.
1. A method of bonding a plurality of die having a plurality of metal layers on a die surface to a board or metal lead frame, comprising:
placing a first die onto a solderable surface of the board or the metal lead frame, the first die comprising at least three metal layers, the board comprising one of a ceramic board or substrate board, or a metal lead frame wherein a top metal die layer is disposed against the solderable surface of the first die;
first reflowing at least one of first and second metal die layers of the first die at a first reflow temperature in a range of 220 degrees C. to 260 degrees C. for a first period to form a first alloy to create a bond between the first die and the board or metal lead frame; and
maintaining heat at the first reflow temperature for a second period to reflow the board or metal lead frame and the first and second metal die layers to form a second alloy
placing a second die onto the solderable surface of the board or the metal lead frame, the second die comprising at least three metal layers, wherein a top metal die layer is disposed against the solderable surface of the second die;
second reflowing at least one of first and second metal die layers of the second die at the first reflow temperature in the range of 220 degrees C. to 260 degrees C. for the first period to form the first alloy to create a bond between the second die and the board or metal lead frame; and
maintaining heat at the first reflow temperature for the second period to reflow the board or metal lead frame and the first and second metal die layers of the second die to form the second alloy,
wherein the first and second alloys have melting temperature temperatures that are higher than 260 degrees C.
2. The method of claim 1 wherein the solderable surface comprises copper and the first and second metal die layers of each of the first die and the second die comprise silver and tin, respectively.
3. The method of claim 1 wherein at least one layer of each of the first die and the second die comprises nickel and at least one layer comprises silver.
4. The method of claim 1 wherein the second period is long enough to cause the solderable surface and both the second metal layer and a third metal layer of each of the first die and the second die on the die to form a third alloy.
5. The method of claim 1 wherein each of the first reflowing and the second reflowing is for a period that causes an alloy to form comprising nickel, silver and tin.
6. The method of claim 1 wherein the board comprises a ceramic board with copper and silver layers and wherein each of the first die and the second die comprises nickel, silver and tin layers.
7. The method of claim 1 wherein the first alloy melting temperature of each of the first die and the second die is at least 10 degrees C. higher than the first reflow temperature.
8. A method of bonding a die to a board, comprising:
placing a first die having a first solderable surface against a board without using a solder paste, the board having a second solderable surface, the board further comprising one of a ceramic or substrate board;
wherein the first solderable surface of the first die comprises a first plurality of metal layers comprising at least three metal layers and wherein an outer layer of the first solderable surface comprises a silver and tin alloy having a silver composition that is less than 7 percent by weight and further wherein an inner layer next to the outer layer is either a metal layer or metal alloy layer that comprises one of titanium, nickel or silver;
reflowing the first die at a first reflow temperature to form a first additional alloy having a first melting temperature that is higher than the first reflow temperature wherein the first additional alloy bonds the first die to the board;
maintaining heat at the first reflow temperature for a second period to reflow the board and the outer and inner layers to form a second additional alloy having a second melting temperature that is higher than the first reflow temperature;
subsequently placing a second die having a second solderable die surface onto the second solderable surface of the board and reflowing at the first reflow temperature without reflowing the first additional alloy of the first die to create a second additional alloy having a melting temperature that is higher than the first reflow temperature; and
subsequently reflowing the second die for a second period to create a fourth additional alloy.
9. The method of claim 8 wherein the second solderable surface of the board comprises at least one of copper, silver and tin layers.