Packaging photon building blocks having only top side connections in a molded interconnect structure
Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.
1. An LED system, comprising:
a substrate with a top surface and a perimeter;
an array of LED dies disposed on the top surface, wherein electrical connections to the LED dies are made only through a plurality of top-side contacts disposed on the top surface of the substrate; and
a lens disposed over at least one of the LED dies, wherein the lens is molded from a material, wherein the material is disposed over substantially all of the top surface of the substrate except over the plurality of top-side contacts, and wherein a cut pattern is present around the perimeter.
2. The LED system of claim 1 , wherein the cut pattern is taken from the group consisting of: a v-cut pattern, a saw-blade cut pattern, a punch-cut pattern and a laser cut pattern.
3. The LED system of claim 1 , wherein the cut pattern is a combinations of cut patterns taken from the group consisting of: a v-cut pattern, a saw-blade cut pattern, a punch-cut pattern and a laser cut pattern.
4. The LED system of claim 1 , wherein the substrate is a portion of a closed board that has been detached from the closed board.
5. The LED system of claim 1 , further comprising:
a plurality of solder connections formed on the plurality of top-side contacts; and
a plurality of leads coupled to the plurality of solder connections.
6. The LED system of claim 1 , wherein the substrate is rectangular and has four sides, and wherein the cut pattern is present on each of the four sides.
7. The LED system of claim 1 , wherein the cut pattern is a v-cut pattern with a thin middle portion that is rougher than cut portions above and below the thin middle portion.
8. The LED system of claim 1 , wherein the substrate is rectangular and has four upper edges, and wherein the material extends to each of the four upper edges of the substrate.
9. The LED system of claim 1 , wherein the substrate has a bottom surface, and wherein the substrate has no electrical contact on the bottom surface.
10. The LED system of claim 1 , wherein the substrate is rectangular and has four upper edges, and wherein there are less than three millimeters between one of the four upper edges of the substrate and an edge of the molded lens.
11. An LED system, comprising:
a substrate with a top surface, wherein the substrate is rectangular and has four side surfaces, and wherein a cut pattern is present on each of the four side surfaces;
a LED die disposed on the top surface, wherein electrical connections to the LED die are made only through a plurality of top-side contacts disposed on the top surface of the substrate; and
a compression molded lens formed over the LED die, wherein the lens is molded from a material, wherein the material is disposed over substantially all of the top surface of the substrate except over the plurality of top-side contacts.
12. The LED system of claim 11 , wherein the substrate has four upper edges between the top surface and the four side surfaces, and wherein there are less than three millimeters between one of the four upper edges and an edge of the compression molded lens.
13. The LED system of claim 11 , wherein the cut pattern is a saw-blade cut pattern.
14. The LED system of claim 11 , wherein the cut pattern is a laser-machined cut pattern.
15. The LED system of claim 11 , wherein the cut pattern is a punch-cut pattern.
16. The LED system of claim 11 , wherein the cut pattern is a v-cut pattern with a thin middle portion that is rougher than cut portions above and below the thin middle portion.
17. The LED system of claim 11 , wherein the substrate has a bottom surface, and wherein the substrate has no electrical contact on the bottom surface.
18. The LED system of claim 11 , wherein the substrate is a portion of a closed board that has been detached from the closed board.
19. The LED system of claim 11 , further comprising:
a plurality of solder connections formed on the plurality of top-side contacts; and
a plurality of leads coupled to the plurality of solder connections.