Systems and methods for lead frame locking design features
Systems and methods for lead frame locking design features are provided. In one embodiment, a method comprises: fabricating a lead frame for a chip package, the lead frame having a paddle comprising a step-out bottom locking feature profile across at least a first segment of an edge of the paddle that provides an interface with a mold compound; etching the paddle to have at least a second segment of the edge having either an extended-step-out bottom locking feature profile or an overhanging top locking feature profile; and alternating first and second segments along the edge of the paddle.
1. A system comprising:
a power source;
a controller having a chip package that includes at least one die mounted to a lead frame, wherein at least a first portion of the lead frame has a locking feature comprising at least a step-out bottom locking feature profile extending the length of an entire side of the lead frame, wherein a depth from a top surface of the lead frame of the step-out bottom locking feature is greater than a width that the step-out bottom locking feature profile extends from the side of the lead frame; and
a component to receive an output of the controller.
2. The system of claim 1 , wherein the controller receives a feedback signal from the component utilized by the chip package to control the output of the controller.
3. The system of claim 1 , the chip package further comprising:
a molding compound that encapsulates the lead frame and the at least one die;
wherein the lead frame is secured to the molding compound by the locking feature.
4. The system of claim 3 , the chip package further comprising one or more secondary elements having an overhanging-top locking feature profile, wherein the one or more secondary elements are secured to the molding compound by the overhanging-top locking feature profile.