Chemical mechanical planarization pad conditioner

1. A chemical mechanical polishing pad conditioner, comprising:

a substrate including a front surface having a plurality of protrusions integral therewith, each of said plurality of protrusions extending in a frontal direction about a respective registration axis normal to said front surface, said plurality of protrusions including;

a first subset of protrusions, each having a first base dimension that is substantially similar, said first subset of protrusions defining a first pattern and defining a first statistical distribution having a first average height and a first standard deviation; and

a second subset of protrusions, each having a second base dimension that is substantially similar, said second subset of protrusions defining a second pattern and defining a second statistical distribution having a second average height and a second standard deviation, said first statistical distribution and said second statistical distribution combining to define a bimodal distribution,

wherein said first base dimension is greater than said second base dimension and at least a portion of said second subset of protrusions are interspersed amongst at least a portion of said first subset of protrusions.

2. The chemical mechanical polishing pad conditioner of claim 1 , wherein at least one of said first predetermined pattern and said second predetermined pattern is matrixical.

3. The chemical mechanical polishing pad conditioner of claim 1 , wherein second average height is less than said first average height.

4. The chemical mechanical polishing pad conditioner of claim 1 , wherein said first and second base dimensions are measured at a distance of about 5 μm to about 10 μm in said frontal direction from a lowest encircling contour line of each respective protrusion.

5. The chemical mechanical polishing pad conditioner of claim 1 , wherein said first and second base dimensions are measured at a distance of about 5% to about 20% of a respective height of a protrusion in said frontal direction from a lowest encircling contour line of the respective protrusion.

6. The chemical mechanical polishing pad conditioner of claim 1 , wherein a fraction of said second subset of protrusions have respective heights that are greater than the respective height of at least one of said first subset of protrusions.

7. The chemical mechanical polishing pad conditioner of claim 1 , wherein said first base dimension and said second base dimension is a diameter.

8. A chemical mechanical polishing pad conditioner, comprising:

a substrate including a front surface having a plurality of protrusions integral therewith, said plurality of protrusions extending in a frontal direction that is substantially normal to said front surface, each of said plurality of protrusions including a distal extremity, said plurality of protrusions including:

a first subset of protrusions having said distal extremities that are within a first variance centered about a first registration plane, said first registration plane being substantially parallel to said front surface, the protrusions of said first subset of protrusions being located on said substrate in a predetermined relationship relative to each other; and

a second subset of protrusions having said distal extremities that are within a second variance centered about a second registration plane, said second registration plane being substantially parallel to said front surface, the protrusions of said second subset of protrusions being located on said substrate in a fixed and predetermined relationship relative to each other, at least a portion of said second subset of protrusions being interspersed amongst at least a portion of said first subset of protrusions,

each of said second subset of protrusions having a root-mean-square surface roughness that is greater than 3 μm.

9. The pad conditioner of claim 8 , wherein at least one of said first variance and said second variance is in a range of 10 μm to 60 μm.

10. The pad conditioner of claim 8 , wherein the protrusions of said first subset of said plurality of protrusions pass through said second registration plane of said second subset of said plurality of protrusions at locations that are predetermined relative to said second subset of said plurality of protrusions.

11. The pad conditioner of claim 8 , wherein said first subset of said plurality of protrusions are uniformly distributed with respect to each other.

12. The pad conditioner of claim 8 , wherein said first registration plane is nominally offset from said second registration plane in said frontal direction by an offset distance that is greater than one of said first variance and said second variance.

13. The pad conditioner of claim 12 , wherein said offset distance is at least two times greater than one of said first variance and said second variance.

14. The pad conditioner of claim 12 , wherein said offset distance is 10 μm or greater.

15. The pad conditioner of claim 8 , further comprising a coating of polycrystalline diamond that covers at least one of said distal extremities of said first subset or of said second subset of said plurality of protrusions.

16. The pad conditioner of claim 15 , wherein said coating of polycrystalline diamond is between 2 μm and 30 μm thickness.

17. The pad conditioner of claim 15 , wherein said coating of polycrystalline diamond has a root-mean-square roughness greater than 3 μm.

18. The pad conditioner of claim 17 , wherein said root-mean-square roughness is less than 10 μm.

19. The pad conditioner of claim 8 , wherein said predetermined relationship of the protrusions of said first subset of said plurality of protrusions establish a repeating pattern.

20. The pad conditioner of claim 19 , wherein said repeating pattern is matrixical.

21. The pad conditioner of claim 8 , wherein said substrate is a porous material including pore dimensions greater than 20 μm.