Method for evaluating semiconductor film and method for manufacturing semiconductor device
A method for evaluating a semiconductor film of a semiconductor device which is configured to include an insulating film, the semiconductor film, and a conductive film and to have a region where the semiconductor film and the conductive film overlap with each other with the insulating film provided therebetween, includes a step of performing plasma treatment after formation of the insulating film, and a step of calculating a peak value of resistivity of a microwave in the semiconductor film by a microwave photoconductive decay method after the plasma treatment, so that the hydrogen concentration in the semiconductor film is estimated.
1. A method for evaluating an oxide semiconductor film in a semiconductor device comprising an insulating film, the oxide semiconductor film, and a conductive film,
wherein the oxide semiconductor film includes a region overlapping with the conductive film with the insulating film provided therebetween,
wherein plasma treatment is performed after the insulating film is formed, and
wherein after the plasma treatment, a peak value of reflectivity of a microwave in the oxide semiconductor film is calculated by a microwave photoconductive decay method, so that a hydrogen concentration in the oxide semiconductor film is estimated from a relation between peak values of reflectivity of microwave and hydrogen concentrations measured by SIMS in oxide semiconductor films.
2. The method for evaluating an oxide semiconductor film according to claim 1 , wherein in the microwave photoconductive decay method, an excitation light with a wavelength less than or equal to 349 nm is used.
3. The method for evaluating an oxide semiconductor film according to claim 1 ,
wherein the oxide semiconductor film includes an oxide containing at least one of indium, zinc, and an element M, and
wherein the element M is aluminum, gallium, yttrium, or tin.
4. The method for evaluating an oxide semiconductor film according to claim 1 ,
wherein the semiconductor film other than a region that is to be a channel formation region therein is irradiated with an excitation light during the measurement of microwave photoconductive decay method.
5. A method for evaluating an oxide semiconductor film in a semiconductor device comprising an insulating film, the oxide semiconductor film, and a conductive film,
wherein the oxide semiconductor film includes a region overlapping with the conductive film with the insulating film provided therebetween,
wherein plasma treatment is performed after the insulating film is formed,
wherein a gas containing oxygen is used for the plasma treatment, and
wherein after the plasma treatment, a peak value of reflectivity of a microwave in the oxide semiconductor film is calculated by a microwave photoconductive decay method, so that a hydrogen concentration in the oxide semiconductor film is estimated from a relation between peak values of reflectivity of microwave and hydrogen concentrations measured by SIMS in oxide semiconductor films.
6. The method for evaluating an oxide semiconductor film according to claim 5 , wherein in the microwave photoconductive decay method, an excitation light with a wavelength less than or equal to 349 nm is used.
7. The method for evaluating an oxide semiconductor film according to claim 5 ,
wherein the oxide semiconductor film includes an oxide containing at least one of indium, zinc, and an element M, and
wherein the element M is aluminum, gallium, yttrium, or tin.
8. The method for evaluating an oxide semiconductor film according to claim 5 ,
wherein the semiconductor film other than a region that is to be a channel formation region therein is irradiated with an excitation light in the microwave photoconductive decay method.
9. A method for manufacturing a semiconductor device, comprising the steps of:
forming an oxide semiconductor film;
forming an insulating film over the oxide semiconductor film;
performing plasma treatment on the insulating film;
evaluating the oxide semiconductor film by a microwave photoconductive decay method after forming the insulating film;
estimating a hydrogen concentration in the oxide semiconductor film from a predetermined relation between peak values of reflectivity of microwave measured by a microwave photoconductive decay method and hydrogen concentrations measured by SIMS in oxide semiconductor films, and
forming a conductive film over the insulating film,
wherein the plasma treatment is performed for a time period longer than or equal to 90 seconds and shorter than 180 seconds.
10. The method for manufacturing a semiconductor device according to claim 9 , wherein a gas containing oxygen is used for the plasma treatment.
11. The method for manufacturing a semiconductor device according to claim 9 , wherein the oxide semiconductor film includes an oxide containing at least one of indium, zinc, and an element M, and
wherein the element M is aluminum, gallium, yttrium, or tin.
12. The method for manufacturing a semiconductor device according to claim 9 ,
wherein the semiconductor film other than a region that is to be a channel formation region therein is irradiated with an excitation light in the microwave photoconductive decay method.
13. A method for manufacturing a semiconductor device, comprising the steps of:
forming an oxide semiconductor film;
forming an insulating film over the oxide semiconductor film;
performing plasma treatment on the insulating film;
evaluating the oxide semiconductor film by a microwave photoconductive decay method after forming the insulating film;
estimating a hydrogen concentration in the oxide semiconductor film from a predetermined relation between peak values of reflectivity of microwave measured by a microwave photoconductive decay method and hydrogen concentrations measured by SIMS in oxide semiconductor films, and
forming a conductive film over the insulating film.
14. The method for manufacturing a semiconductor device according to claim 13 , wherein a gas containing oxygen is used for the plasma treatment.
15. The method for manufacturing a semiconductor device according to claim 13 , wherein the oxide semiconductor film includes an oxide containing at least one of indium, zinc, and an element M, and
wherein the element M is aluminum, gallium, yttrium, or tin.
16. The method for manufacturing a semiconductor device according to claim 13 ,
wherein the semiconductor film other than a region that is to be a channel formation region therein is irradiated with an excitation light in the microwave photoconductive decay method.