IP Library Granted Patent US 9,722,135
Granted Patent B2
US 9,722,135 · App. 14/879,502 · Granted Aug 1, 2017

Nanowire sized opto-electronic structure and method for modifying selected portions of same

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Quick Facts
Patent No.
US 9,722,135
App. No.
14/879,502
Granted
Aug 1, 2017
Kind
B2
Abstract

A LED structure includes a support and a plurality of nanowires located on the support, where each nanowire includes a tip and a sidewall. A method of making the LED structure includes reducing or eliminating the conductivity of the tips of the nanowires compared to the conductivity of the sidewalls during or after creation of the nanowires.

Claims (11)

1. A method of making a LED structure that comprises a support and a plurality of multilayer nanowires located on the support, wherein each nanowire comprises a tip and a sidewall, wherein the method comprises depositing a GaN layer of the nanowires by MOCVD using a carrier gas that comprises H 2 to reduce or eliminate a conductivity of the tips of the nanowires compared to the conductivity of the sidewalls during creation of the nanowires.

2. The method of claim 1 , wherein the nanowires comprise a multilayer structure and the GaN layer of the nanowires is formed using a carrier gas that comprises the H 2 and an inert MOCVD carrier gas.

3. The method of claim 2 , wherein the H 2 in the carrier gas is provided at 500 sccm or less.

4. The method of claim 1 , wherein the GaN layer of the nanowires comprises a GaN barrier layer for an active region of the LED structure.

5. The method of claim 4 , wherein the active region comprises an InGaN light emitting layer.

6. The method of claim 5 , wherein the GaN barrier layer is deposited by the MOCVD on the InGaN light emitting layer.

7. The method of claim 5 , wherein the InGaN light emitting layer is selectively deposited on a m-plane of the nanowires but not on a p-plane of the nanowires.

8. The method of claim 5 , wherein the InGaN light emitting layer is deposited over a GaN core of the nanowires by MOCVD using a carrier gas that does not contain H 2 .

9. The method of claim 5 , wherein the InGaN light emitting layer is etched on a p-plane of the nanowires during deposition of the GaN barrier layer by the MOCVD using the carrier gas that comprises H 2 .

10. The method of claim 5 , wherein deposition of the GaN barrier layer by the MOCVD using the carrier gas that comprises H 2 reduces a growth rate of the active region on a p-plane of the nanowire without reducing the growth rate of the active region on a m-plane of the nanowire.

11. The method of claim 1 , wherein a conductivity of the tip is reduced by at least one order of magnitude by using the carrier gas that comprises H 2 compared to the conductivity of the tip deposited without using the carrier gas that comprises H 2 .

Assignments (9)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2024
From: GLO TECHNOLOGIES LLC
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 068297/0220 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 6, 2023
From: SYSONAN, INC.
To: GLO TECHNOLOGIES LLC
Reel/Frame 065178/0210 →
CHANGE OF NAME Recorded Oct 5, 2023
From: NANOSYS, INC.
To: SYSONAN, INC.
Reel/Frame 065156/0416 →
TERMINATION AND RELEASE OF PATENT SECURITY AGREEMENT RECORDED AT REEL 059569 / FRAME 0840 Recorded Sep 7, 2023
From: FORTRESS CREDIT CORP.,
To: NANOSYS, INC.
Reel/Frame 064836/0263 →
SECURITY INTEREST Recorded Apr 1, 2022
From: NANOSYS, INC.
To: FORTRESS CREDIT CORP., AS AGENT
Reel/Frame 059569/0840 →
NUNC PRO TUNC ASSIGNMENT Recorded Aug 13, 2021
From: GLO AB
To: NANOSYS, INC.
Reel/Frame 057184/0564 →
RELEASE OF SECURITY INTEREST Recorded Apr 12, 2021
From: HERCULES CAPITAL, INC.
To: GLO AB
Reel/Frame 057210/0690 →
SECURITY INTEREST Recorded Jan 23, 2019
From: GLO AB
To: HERCULES CAPITAL INC.
Reel/Frame 048110/0063 →
ASSIGNMENT OF IP SECURITY AGREEMENT Recorded Dec 12, 2018
From: GLO AB
To: HERCULES CAPITAL, INC., AS ADMINISTRATIVE AGENT
Reel/Frame 049042/0527 →