Structures, methods and applications for electrical pulse anneal processes
Structures and methods are provided for nanosecond electrical pulse anneal processes. The method of forming an electrostatic discharge (ESD) N+/P+ structure includes forming an N+ diffusion on a substrate and a P+ diffusion on the substrate. The P+ diffusion is in electrical contact with the N+ diffusion. The method further includes forming a device between the N+ diffusion and the P+ diffusion. A method of annealing a structure or material includes applying an electrical pulse across an electrostatic discharge (ESD) N+/P+ structure for a plurality of nanoseconds.
1. An electrostatic discharge (ESD) N+/P+ structure, comprising:
a buried oxide (BOX) layer formed on a substrate;
an N+ diffusion on the substrate;
a P+ diffusion on the substrate and in electrical contact with the N+ diffusion; and
a device on the substrate and in direct electrical and physical contact with at least one of the N+ diffusion and the P+ diffusion, wherein each of the device, the N+ diffusion and the P+ diffusion are formed directly and physically on the BOX layer.
2. The ESD N+/P+ structure of claim 1 , further comprising a first contact on the P+ diffusion and a second contact on the N+ diffusion to provide an electrical pulse to the P+ diffusion and allow the electrical pulse to flow out of the N+ diffusion, respectively.
3. The ESD N+/P+ structure of claim 1 , wherein the N+ diffusion and the P+ diffusion form an ESD diode.
4. The ESD N+/P+ structure of claim 1 , wherein the N+ diffusion acts as a cathode and the P+ diffusion acts as an anode.
5. The ESD N+/P+ structure of claim 4 , wherein the device comprises an active region, and the ESD N+/P+ structure further comprises contacts formed in electrical contact with the N+ diffusion and the P+ diffusion, respectively, for supplying an electrical pulse to generate heat across the active region.
6. The ESD N+/P+ structure of claim 5 , wherein the contacts comprise a first contact and a second contact, wherein the first contact allows the electric pulse to flow through the anode and the second contact allows the electric pulse to flow out of the cathode.
7. The ESD N+/P+ structure of claim 6 , wherein the device is an active device formed in electrical contact with the N+ diffusion and P+ diffusion.
8. The ESD N+/P+ structure of claim 6 , wherein the device is a passive device formed in electrical contact with the N+ diffusion and P+ diffusion.
9. An electrostatic discharge (ESD) N+/P+ structure comprising:
a buried oxide (BOX) layer formed on a substrate;
an N+ diffusion on the substrate;
a P+ diffusion on the substrate and in electrical contact with the N+ diffusion; and
a device on the substrate between and in direct electrical and physical contact with the N+ diffusion and the P+ diffusion,
wherein the N+ diffusion and the P+ diffusion are in a side by side relationship, and
wherein each of the device, the N+ diffusion and the P+ diffusion are formed directly and physically on the BOX layer.
10. The ESD N+/P+ structure of claim 9 , wherein the N+ diffusion and the P+ diffusion form an ESD diode configured to generate localized heat at the device of between 500° K and 1200° K.
11. The ESD N+/P+ structure of claim 10 , wherein the device comprises an active area of 50 μm 2 -100 μm 2 .
12. The ESD N+/P+ structure of claim 9 , wherein the device comprises one of the group consisting of a small circuit for a phase-locked loop; a phase-lock loop; a ring oscillator; and a voltage controlled oscillator.