IP Library Granted Patent US 9,385,317
Granted Patent B2
US 9,385,317 · App. 14/884,035 · Granted Jul 5, 2016

Memory cells and methods of forming memory cells

Inventors: Martin Schubert (Sunnyvale, CA); Shu Qin (Boise, ID); Scott E. Sills (Boise, ID); Durai Vishak Nirmal Ramaswamy (Boise, ID); Allen McTeer (Eagle, ID); Yongjun Jeff Hu (Boise, ID)
Assignee: Micron Technology, Inc.
H01L45/1608H01L45/08H01L45/085H01L45/12H01L45/1233H01L45/1266H01L45/146H01L45/16
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Quick Facts
Patent No.
US 9,385,317
App. No.
14/884,035
Granted
Jul 5, 2016
Kind
B2
Abstract

Some embodiments include a memory cell having a first electrode, and an intermediate material over and directly against the first electrode. The intermediate material includes stabilizing species corresponding to one or both of carbon and boron. The memory cell also has a switching material over and directly against the intermediate material, an ion reservoir material over the switching material, and a second electrode over the ion reservoir material. Some embodiments include methods of forming memory cells.

Claims (18)

1. A memory cell, comprising:

a first electrode comprising titanium;

an intermediate material over and directly against the first electrode, the intermediate material comprising stabilizing species corresponding to one or both of carbon and boron;

a switching material over and directly against the intermediate material;

an ion reservoir material over the switching material;

a second electrode over the ion reservoir material, the second electrode comprising tungsten; and

wherein the intermediate material comprises a gradient of stabilizing species concentration, with said concentration being lowest directly adjacent the first electrode and being highest directly adjacent the switching material.

2. The memory cell of claim 1 wherein the intermediate material comprises a thickness within a range of from greater than 0 angstroms to less than or equal to about 50 angstroms.

3. The memory cell of claim 1 wherein the intermediate material comprises a thickness within a range of from greater than or equal to about 10 angstroms to less than or equal to about 50 angstroms.

4. The memory cell of claim 1 wherein a surface of the intermediate material directly against the switching material comprises a total concentration of said stabilizing species of from about 15 atomic percent to about 100 atomic percent.

5. The memory cell of claim 1 wherein a surface of the intermediate material directly against the switching material comprises a total concentration of said stabilizing species of from about 90 atomic percent to about 100 atomic percent.

6. The memory cell of claim 1 wherein a surface of the intermediate material directly against the switching material comprises a total concentration of said stabilizing species of about 100 atomic percent.

7. The memory cell of claim 1 wherein:

a surface of the intermediate material directly against the switching material comprises a total concentration of said stabilizing species of from about 90 atomic percent to about 100 atomic percent; and

a surface of the intermediate material directly against the first electrode comprises a total concentration of said stabilizing species of from about 0 atomic percent to less than or equal to about 10 atomic percent.

8. The memory cell of claim 1 wherein the intermediate material comprises carbon.

9. The memory cell of claim 1 wherein the intermediate material comprises boron.

10. The memory cell of claim 1 wherein the intermediate material comprises carbon and boron.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
Continuity (3)
Continuation 14618936 · Feb 10, 2015
Division 14070407 · Nov 1, 2013
Related Publication 20160035974A1 · Feb 4, 2016