Radiation detector having a bandgap engineered absorber
A radiation detector is provided that includes a photodiode having a radiation absorber with a graded multilayer structure. Each layer of the absorber is formed from a semiconductor material, such as HgCdTe. A first of the layers is formed to have a first predetermined wavelength cutoff. A second of the layers is disposed over the first layer and beneath the first surface of the absorber through which radiation is received. The second layer has a graded composition structure of the semiconductor material such that the wavelength cutoff of the second layer varies from a second predetermined wavelength cutoff to the first predetermined wavelength cutoff such that the second layer has a progressively smaller bandgap than the first bandgap of the first layer. The graded multilayer radiation absorber structure enables carriers to flow toward a conductor that is used for measuring the radiation being sensed by the radiation absorber.
1. A method of sensing radiation, the method comprising:
receiving radiation by a first radiation absorber layer;
in response to receiving the radiation by the first radiation absorption layer, generating charge carriers;
applying a bias voltage to a second radiation absorption layer, thereby generating an electric field gradient in the second radiation absorption layer;
drifting the charge carriers towards a metal layer in contact with the first radiation absorption layer and the second radiation absorption layer in response to the electric field gradient; and
outputting a signal representative of the drifted charge carriers, the signal being usable for measuring the sensed radiation.
2. The method of claim 1 , wherein the first radiation absorption layer comprises a semiconductor material and is characterized by a first predetermined wavelength cutoff.
3. The method of claim 2 , wherein the second radiation absorption layer comprises a graded composition of the semiconductor material and is characterized by a wavelength cutoff that varies from a second predetermined wavelength cutoff to the first predetermined wavelength cutoff.
4. The method of claim 3 , further comprising collecting the drifted charge carriers in a third radiation absorption layer, the collected charge carriers being used to generate the outputted signal.
5. The method of claim 4 , wherein the third radiation absorption layer comprises the semiconductor material and is characterized by the second predetermined wavelength cutoff.
6. The method of claim 5 , wherein the semiconductor material comprises HgCdTe.
7. The method of claim 6 , wherein the metal layer is in electrical communication with an input preamp that is part of a readout integrated circuit.
8. The method of claim 1 , wherein the bias voltage is applied such that the outputted signal is not amplified.
9. The method of claim 8 , wherein the applied bias voltage is less than or equal to 0.2 V.
10. The method of claim 1 , wherein the bias voltage is applied such that the outputted signal is amplified.
11. The method of claim 10 , wherein the applied bias voltage causes an n-type region of the first radiation absorption layer and the second radiation absorption layer to become depleted, thereby resulting in avalanche multiplication of the drifted charge carriers.
12. The method of claim 10 , wherein the applied bias voltage is equal to or greater than 3 V.
13. The method of claim 10 , wherein the applied voltage is equal to or greater than 6 V.
14. The method of claim 1 , wherein the first radiation absorption layer and the second radiation absorption layer have a p-type region and an n-type region.
15. The method of claim 1 , further comprising cooling the first radiation absorption layer and the second radiation absorption layer to a temperature of 226K or greater to achieve a noise equivalent flux of 2.5×10 8 photons/sec/cm 2 or greater.