Silicon carbide semiconductor device and method of manufacturing the same
The silicon carbide semiconductor layer includes a first impurity region, a second impurity region, and a third impurity region. Turning to a first position at which an impurity concentration 1/10 as high as a highest impurity concentration is exhibited in a concentration profile of an impurity having the first conductivity type in a direction perpendicular to the main surface in the third impurity region and a second position at which an impurity concentration 1/10 as high as a highest impurity concentration is exhibited in a concentration profile of an impurity having the second conductivity type in the direction perpendicular to the main surface in the second impurity region, a first depth from the main surface to the first position is shallower than a second depth from the main surface to the second position. The electrode is electrically connected to the second impurity region and the third impurity region.
1. A silicon carbide semiconductor device, comprising:
a silicon carbide semiconductor layer including a main surface; and
an electrode formed on the main surface,
the silicon carbide semiconductor layer including
a first impurity region having a first conductivity type,
a second impurity region including the main surface, provided in the first impurity region, and having a second conductivity type different from the first conductivity type, and
a third impurity region including the main surface, provided in the first impurity region, formed adjacently to the second impurity region, and having the first conductivity type,
wherein a first position exists at which an impurity concentration 1/10 as high as a highest impurity concentration is exhibited in a concentration profile of an impurity having the first conductivity type in a direction perpendicular to the main surface in the third impurity region and a second position exists at which an impurity concentration 1/10 as high as a highest impurity concentration is exhibited in a concentration profile of an impurity having the second conductivity type in the direction perpendicular to the main surface in the second impurity region, a first depth from the main surface to the first position being shallower than a second depth from the main surface to the second position, and
the electrode being electrically connected to the second impurity region and the third impurity region.
2. The silicon carbide semiconductor device according to claim 1 , wherein
a depth from the main surface, of a position at which the highest impurity concentration is exhibited in the third impurity concentration is not greater than 0.1 μm.
3. The silicon carbide semiconductor device according to claim 1 , wherein
the first depth is not greater than 0.2 μm.
4. The silicon carbide semiconductor device according to claim 1 , wherein
the silicon carbide semiconductor layer is provided with a trench at which the first impurity region and the second impurity region are exposed at a sidewall, and
the silicon carbide semiconductor device further comprises a gate oxide film formed on the sidewall of the trench and a gate electrode formed on the gate oxide film.
5. The silicon carbide semiconductor device according to claim 4 , wherein the sidewall includes a first plane having a plane orientation {0-33-8}.
6. The silicon carbide semiconductor device according to claim 1 , wherein
the first impurity region includes the main surface, and
the silicon carbide semiconductor device further comprises a gate oxide film formed on the main surface included in the first impurity region and a gate electrode formed on the gate oxide film.
7. A method of manufacturing a silicon carbide semiconductor device, comprising the steps of:
preparing a silicon carbide semiconductor layer including a first impurity region having a first conductivity type;
forming a mask layer on a main surface of the silicon carbide semiconductor layer, an opening portion being formed over the first impurity region in the mask layer and the mask layer including in the opening portion, a protection mask portion arranged at a distance from an inner peripheral wall surface of the opening portion;
forming a second impurity region having a second conductivity type different from the first conductivity type by implanting ions into the first impurity region other than at least a region under the protection mask portion in the opening portion with the mask layer serving as a mask;
removing the mask layer; and
forming a third impurity region having the first conductivity type in a region within the first impurity region which has been located under the protection mask portion, by implanting ions into the silicon carbide semiconductor layer,
in the step of forming a mask layer, the protection mask portion is formed to be smaller in thickness than a portion in the mask layer other than the protection mask portion, and
in the step of forming a second impurity region, a fourth impurity region having the second conductivity type is formed by implanting ions into the silicon carbide semiconductor layer with the protection mask portion being interposed.
8. A method of manufacturing a silicon carbide semiconductor device, comprising the steps of:
preparing a silicon carbide semiconductor layer including a first impurity region having a first conductivity type;
forming a mask layer on a main surface of the silicon carbide semiconductor layer, an opening portion being formed over the first impurity region in the mask layer and the mask layer including in the opening portion, a protection mask portion arranged at a distance from an inner peripheral wall surface of the opening portion;
forming a second impurity region having a second conductivity type different from the first conductivity type by implanting ions into the first impurity region other than at least a region under the protection mask portion in the opening portion with the mask layer serving as a mask;
removing the mask layer; and
forming a third impurity region having the first conductivity type in a region within the first impurity region which has been located under the protection mask portion, by implanting ions into the silicon carbide semiconductor layer,
wherein in the step of forming a third impurity region, a first position exists at which an impurity concentration 1/10 as high as a highest impurity concentration is exhibited in a concentration profile of an impurity having the first conductivity type in a direction perpendicular to the main surface in the third impurity region and a second position exists at which an impurity concentration 1/10 as high as a highest impurity concentration is exhibited in a concentration profile of an impurity having the second conductivity type in the direction perpendicular to the main surface in the second impurity region which has been formed in the step of forming a second impurity region, the third impurity region is formed such that a first depth from the main surface to the first position is shallower than a second depth from the main surface to the second position.
9. The method of manufacturing a silicon carbide semiconductor device according to claim 7 , wherein
in the step of forming a mask layer, the mask layer in which the protection mask portion is formed from a single layer and a portion other than the protection mask portion is formed from two layers is formed.
10. The method of manufacturing a silicon carbide semiconductor device according to claim 8 , wherein
in the step of forming a mask layer, the mask layer in which the protection mask portion is formed from a single layer and a portion other than the protection mask portion is formed from two layers is formed.