Semiconductor device having overlapped via apertures
View Patent ↗Disclosed is a semiconductor device having overlapped via apertures formed in an encapsulant to outwardly expose solder balls. When different types of semiconductor devices are electrically connected to the solder balls through the overlapped via apertures, flux or solder paste is unlikely to contact sidewall portions of the overlapped via apertures. Therefore, different types of semiconductor devices can be mounted with improved efficiency.
1. An assembly comprising:
a substrate comprising a first surface;
a semiconductor die coupled to the first surface of the substrate;
an encapsulant covering the first surface of the substrate and at least a first surface of the semiconductor die, the encapsulant comprising:
a first encapsulant surface facing the substrate; and
a second encapsulant surface opposite the first encapsulant surface;
a plurality of solder balls coupled to the first surface of the substrate; and
a plurality of overlapped via apertures in the encapsulant, each of which exposing a respective one of the plurality of solder balls,
wherein the encapsulant comprises a central protrusion completely surrounded by the overlapped via apertures.
2. The assembly of claim 1 , wherein the central protrusion comprises a plurality of vertices, each of which pointing between two adjacent ones of the solder balls.
3. The assembly of claim 2 , wherein each of the plurality of vertices is located at a point of intersection between two adjacent sides of the plurality of sides of the central protrusion and a top end of the central protrusion.
4. The assembly of claim 1 , wherein each pair of the overlapped via apertures are separated by a sidewall portion of the encapsulant that extends directly between the central protrusion and a second central protrusion that is identical to the central protrusion, the sidewall portion having a height different from a height of the central protrusion.
5. The assembly of claim 4 , wherein directly between respective centers of the central protrusion and the second central protrusion, the height of the sidewall portion dips toward the substrate.
6. The assembly of claim 1 , wherein second encapsulant surface is separated from the first encapsulant surface by an encapsulant thickness, and the central protrusion comprises a protrusion thickness equal to the encapsulant thickness.
7. An assembly comprising:
a substrate comprising a first surface;
a semiconductor die coupled to the first surface of the substrate;
an encapsulant covering the first surface of the substrate and at least a first surface of the semiconductor die, the encapsulant comprising:
a first encapsulant surface facing the substrate; and
a second encapsulant surface opposite the first encapsulant surface and separated from the first encapsulant surface by an encapsulant thickness;
a plurality of solder balls coupled to the first surface of the substrate; and
a plurality of overlapped via apertures in the encapsulant, each of which exposing a respective one of the plurality of solder balls,
wherein the encapsulant comprises a central protrusion completely surrounded by the overlapped via apertures and having a protrusion thickness equal to the encapsulant thickness, the central protrusion comprising:
a plurality of sides, each of which facing a respective one of the solder balls; and
a plurality of vertices, each of which pointing between two adjacent ones of the solder balls.
8. The assembly of claim 7 , wherein each of the plurality of vertices is located at a point of intersection between two adjacent sides of the plurality of sides of the central protrusion and a top end of the central protrusion.
9. The assembly of claim 7 , wherein each pair of the overlapped via apertures are separated by a sidewall portion of the encapsulant that extends directly between the central protrusion and a second central protrusion that is identical to the central protrusion, the sidewall portion having a height different from a height of the central protrusion.
10. The assembly of claim 9 , wherein directly between respective centers of the central protrusion and the second central protrusion, the height of the sidewall portion dips toward the substrate.
11. The assembly of claim 7 , wherein the central protrusion comprises a flat surface facing away from the substrate.
12. The assembly of claim 11 , wherein the flat surface of the central protrusion facing away from the substrate is co-planar with the second encapsulant surface.
13. An assembly comprising:
a substrate comprising a first surface;
a semiconductor die coupled to the first surface of the substrate;
an encapsulant covering the first surface of the substrate and at least a first surface of the semiconductor die, the encapsulant comprising:
a first encapsulant surface facing the substrate; and
a second encapsulant surface opposite the first encapsulant surface;
a plurality of solder balls coupled to the first surface of the substrate; and
a plurality of overlapped via apertures in the encapsulant, each of which exposing a respective one of the plurality of solder balls,
wherein the encapsulant comprises a central protrusion completely surrounded by the overlapped via apertures, the central protrusion comprising:
a plurality of sides, each of which facing a respective one of the solder balls; and
a plurality of vertices, each of which pointing between two adjacent ones of the solder balls.
14. The assembly of claim 13 , wherein each of the plurality of sides of the central protrusion is curved inward toward a center of the central protrusion.
15. The assembly of claim 13 , wherein each of the plurality of vertices is located at a point of intersection between two adjacent sides of the plurality of sides of the central protrusion and a top surface of the central protrusion, where the top surface of the central protrusion is coplanar with the second encapsulant surface.
16. The assembly of claim 13 , wherein each of the plurality of vertices is located at a point of intersection between two adjacent sides of the plurality of sides of the central protrusion and a top end of the central protrusion.
17. The assembly of claim 13 , wherein each pair of the overlapped via apertures are separated by a sidewall portion of the encapsulant that extends directly between the central protrusion and a second central protrusion identical to the central protrusion, the sidewall portion having a height different from a height of the central protrusion.
18. The assembly of claim 17 , wherein directly between respective centers of the central protrusion and the second central protrusion, the height of the sidewall portion dips toward the substrate.
19. The assembly of claim 13 , wherein the central protrusion comprises a flat surface facing away from the substrate.
20. The assembly of claim 19 , wherein the flat surface of the central protrusion facing away from the substrate is co-planar with the second encapsulant surface.