Vertical solid-state transducers having backside terminals and associated systems and methods
Vertical solid-state transducers (“SSTs”) having backside contacts are disclosed herein. An SST in accordance with a particular embodiment can include a transducer structure having a first semiconductor material at a first side of the SST, a second semiconductor material at a second side of the SST opposite the first side, and an active region between the first and second semiconductor materials. The SST can further include first and second contacts electrically coupled to the first and second semiconductor materials, respectively. A portion of the first contact can be covered by a dielectric material, and a portion can remain exposed through the dielectric material. A conductive carrier substrate can be disposed on the dielectric material. An isolating via can extend through the conductive carrier substrate to the dielectric material and surround the exposed portion of the first contact to define first and second terminals electrically accessible from the first side.
1. A solid-state transducer (SST) assembly comprising:
an SST having a first side and a second side opposite the first side, the SST having a transducer structure, a first contact and a second contact, wherein the first and second contacts are configured to be electrically accessible from the first side, wherein the first contact includes a first isolated portion covered by a dielectric material and a first exposed portion not covered by the dielectric material, and wherein the second contact includes a second isolated portion covered by the dielectric material and a second exposed portion not covered by the dielectric material;
a conductive carrier substrate on the first side of the SST, the conductive carrier substrate having a first terminal electrically coupled to the first contact and a second terminal electrically coupled to the second contact;
a first isolating via extending through the conductive carrier substrate to the dielectric material, the first isolating via surrounding the first exposed portion of the first contact and defining the first terminal;
a second isolating via extending through the conductive carrier substrate to the dielectric material, the second isolating via surrounding the second exposed portion of the second contact and defining the second terminal;
a separator positioned proximate to the transducer structure and projecting through the transducer structure toward the second side; and
an optical element positioned on the second side, wherein the separator is positioned proximate to the optical element.
2. The SST assembly of claim 1 wherein the separator comprises:
a dielectric isolator extending along a sidewall proximate to the SST; and
at least one metal material on the dielectric isolator.
3. The SST assembly of claim 1 wherein the optical element comprises a converter element and a cover element, and wherein the separator acts as a barrier between the converter element and the cover element.
4. The SST assembly of claim 1 wherein the optical element comprises a first converter element configured to emit a first color of light and a second converter element configured to emit a second color of light different from the first color of light.
5. The SST assembly of claim 1 wherein:
the transducer structure comprises a first semiconductor material at a first side of the transducer structure, a second semiconductor material at a second side opposite the first side, and an active region between the first and second semiconductor materials, wherein the first and second sides of the transducer structure are proximate the corresponding first and second sides of the SST;
the second contact comprises
a plurality of buried contact elements extending from the first side of the transducer structure into the second semiconductor material, wherein the plurality of buried contact elements is electrically coupled to the second semiconductor material and is electrically isolated from the active region, the first semiconductor material, and the first contact; and
a plurality of conductive lines on the first side of the SST assembly between the buried contact elements, wherein the conductive lines are on an underlying dielectric layer that electrically isolates the conductive lines from the underlying first contact and the first semiconductor material, and wherein the conductive lines and the buried contact elements define the second contacts.
6. The SST assembly of claim 1 , further comprising:
a dielectric layer separating the first and second contacts from the conductive carrier substrate.
7. The SST assembly of claim 1 wherein the SST is configured to emit electromagnetic radiation in at least one of the ultraviolet spectrum, the visible spectrum, and the infrared spectrum.