Semiconductor device
A structure is employed in which a first protective insulating layer; an oxide semiconductor layer over the first protective insulating layer; a source electrode and a drain electrode that are electrically connected to the oxide semiconductor layer; a gate insulating layer that is over the source electrode and the drain electrode and overlaps with the oxide semiconductor layer; a gate electrode that overlaps with the oxide semiconductor layer with the gate insulating layer provided therebetween; and a second protective insulating layer that covers the source electrode, the drain electrode, and the gate electrode are included. Furthermore, the first protective insulating layer and the second protective insulating layer each include an aluminum oxide film that includes an oxygen-excess region, and are in contact with each other in a region where the source electrode, the drain electrode, and the gate electrode are not provided.
1. A semiconductor device comprising:
a first insulating layer comprising aluminum oxide;
an oxide semiconductor layer over the first insulating layer;
a source electrode and a drain electrode electrically connected to the oxide semiconductor layer;
a gate insulating layer over the source electrode and the drain electrode,
a gate electrode overlapping with the oxide semiconductor layer with the gate insulating layer provided therebetween; and
a second insulating layer comprising aluminum oxide over the gate electrode,
wherein the first insulating layer and the second insulating layer are in contact with each other in a region where the source electrode, the drain electrode, and the gate electrode are not provided, and
wherein the first insulating layer comprises a protrusion.
2. The semiconductor device according to claim 1 , wherein the source electrode and the drain electrode are provided over the oxide semiconductor layer.
3. The semiconductor device according to claim 1 , wherein the first insulating layer is in contact with the oxide semiconductor layer.
4. The semiconductor device according to claim 1 , wherein the second insulating layer is in contact with the gate electrode.
5. The semiconductor device according to claim 1 , wherein a thickness of the oxide semiconductor layer is 0.1 times or more and 10 times or less as large as a channel width of the oxide semiconductor layer.
6. The semiconductor device according to claim 1 , wherein the oxide semiconductor layer comprises indium.
7. A semiconductor device comprising:
a first insulating layer comprising aluminum oxide;
an oxide semiconductor layer over the first insulating layer;
a source electrode and a drain electrode electrically connected to the oxide semiconductor layer;
a gate insulating layer over the source electrode and the drain electrode,
a gate electrode over the gate insulating layer, the gate electrode overlapping with the oxide semiconductor layer; and
a second insulating layer comprising aluminum oxide over the gate electrode,
wherein the first insulating layer and the second insulating layer are in contact with each other in a region where the source electrode, the drain electrode, and the gate electrode are not provided.
8. The semiconductor device according to claim 7 , wherein the source electrode and the drain electrode are provided over the oxide semiconductor layer.
9. The semiconductor device according to claim 7 , wherein the first insulating layer is in contact with the oxide semiconductor layer.
10. The semiconductor device according to claim 7 , wherein the second insulating layer is in contact with the gate electrode.
11. The semiconductor device according to claim 7 , wherein a thickness of the oxide semiconductor layer is 0.1 times or more and 10 times or less as large as a channel width of the oxide semiconductor layer.
12. The semiconductor device according to claim 7 , wherein the oxide semiconductor layer comprises indium.
13. A semiconductor device comprising:
a first insulating layer comprising aluminum oxide;
a first oxide layer over the first insulating layer;
an oxide semiconductor layer over the first oxide layer;
a second oxide layer over the oxide semiconductor layer;
a source electrode and a drain electrode electrically connected to the oxide semiconductor layer;
a gate insulating layer over the source electrode and the drain electrode,
a gate electrode over the gate insulating layer, the gate electrode overlapping with the oxide semiconductor layer; and
a second insulating layer comprising aluminum oxide over the gate electrode,
wherein the first insulating layer and the second insulating layer are in contact with each other in a region where the source electrode, the drain electrode, and the gate electrode are not provided.
14. The semiconductor device according to claim 13 , wherein the source electrode and the drain electrode are provided over the oxide semiconductor layer.
15. The semiconductor device according to claim 13 , wherein the first insulating layer is in contact with the first oxide layer.
16. The semiconductor device according to claim 13 , wherein the second insulating layer is in contact with the gate electrode.
17. The semiconductor device according to claim 13 , wherein a thickness of the oxide semiconductor layer is 0.1 times or more and 10 times or less as large as a channel width of the oxide semiconductor layer.
18. The semiconductor device according to claim 13 , wherein the oxide semiconductor layer comprises indium.