Semiconductor device and manufacturing method thereof
View Patent ↗Provided are a semiconductor device and a method of manufacturing the same. A carrier is removed after a first semiconductor die and a second semiconductor die are stacked on each other, and then a first encapsulant is formed, so that the carrier may be easily removed when compared to approaches in which a carrier is removed from a wafer having a thin thickness.
1. A semiconductor device comprising:
a first die comprising a through electrode that electrically connects a conductive member disposed on a first surface of the first die to a corresponding conductive pad disposed on a second surface of the first die opposite the first surface;
a first chip comprising a first surface on which an interconnection structure is disposed, wherein:
the interconnection structure comprising a solder structure, and
the interconnection structure connected to the conductive member on the first surface of the first die via the conductive pad and the through electrode;
a first encapsulant covering at least a portion of the second surface of the first die and at least a side surface of the first chip; and
a second encapsulant surrounding:
the first die,
the first chip, and
the first encapsulant;
wherein:
at least one of the first encapsulant and/or the second encapsulant covers a second surface of the first chip opposite the first surface of the first chip.
2. The semiconductor device of claim 1 , wherein:
the solder structure comprises a pillar.
3. The semiconductor device of claim 1 , wherein:
the first die comprises a semiconductor material.
4. The semiconductor device of claim 1 , wherein:
the through electrode and the conductive pad of the first die comprise circuitry remaining from a grinded-off semiconductor body.
5. The semiconductor device of claim 1 , wherein:
the second surface of the first chip is exposed to the outside of the first encapsulant.
6. The semiconductor device of claim 1 , wherein:
the second surface of the first chip is exposed to the outside of the second encapsulant.
7. The semiconductor device of claim 1 , further comprising:
a cover over the second surface of the first chip and coupled to the first encapsulant.
8. The semiconductor device of claim 1 , wherein:
a surface of the first encapsulant is exposed to the outside of the second encapsulant.
9. The semiconductor device of claim 1 , wherein:
the first encapsulant contacts a second surface of the first chip opposite the first surface of the first chip.
10. The semiconductor device of claim 1 , wherein:
the conductive member comprises a pillar.
11. The semiconductor device of claim 1 , wherein:
the entire second surface of the first chip is contacted by the first encapsulant.
12. The semiconductor device of claim 1 , wherein:
the entire second surface of the first chip is contacted by the second encapsulant.
13. A semiconductor device comprising:
a first die comprising a through electrode that electrically connects a conductive member disposed on a first surface of the first die to a corresponding conductive pad disposed on a second surface of the first die opposite the first surface;
a first chip comprising a first surface on which an interconnection structure is disposed, wherein:
the interconnection structure comprising a solder structure, and
the interconnection structure connected to the conductive member on the first surface of the first die via the conductive pad and the through electrode;
a first encapsulant covering at least a portion of the second surface of the first die and at least a side surface of the first chip;
a circuit board comprising a conductive layer on a first surface connected to the first chip via the conductive member, the through electrode, the conductive pad, and the interconnection structure; and
a cover adhesively attached to a surface of the first encapsulant and to the first surface of the circuit board, the cover surrounding the first die and the first chip.
14. The semiconductor device of claim 13 , wherein:
the first encapsulant contacts a second surface of the first chip opposite the first surface of the first chip.
15. The semiconductor device of claim 13 , wherein:
the conductive member comprises a conductive pillar.
16. A semiconductor device comprising:
a first die comprising a through electrode that electrically connects a conductive member disposed on a first surface of the first die to a corresponding conductive pad disposed on a second surface of the first die opposite the first surface;
a first chip comprising a first surface on which an interconnection structure is disposed, wherein:
the interconnection structure comprising a solder structure, and
the interconnection structure connected to the conductive member on the first surface of the first die via the conductive pad and the through electrode;
a first encapsulant that fills a space between the second surface of the first die and the first surface of the first chip, and that covers at least a side surface of the first chip;
a circuit board comprising a first surface and a second surface opposite the first surface of the circuit board, the second surface of the circuit board comprising a conductive layer facing the first surface of the first die and connected to the first chip via the conductive member, the through electrode, the conductive pad, and the interconnection structure;
an under fill that fills a space between the first surface of the first die and the second surface of the circuit board; and
a second encapsulant that contacts at least a side surface of the first die, at least a side surface of the first encapsulant, at least a portion of the second surface of the circuit board, and at least a portion of a second surface of the first chip opposite the first surface of the first chip.
17. The semiconductor device of claim 16 , wherein:
the conductive member comprises a pillar.
18. The semiconductor device of claim 16 , wherein:
the solder structure comprises a pillar.
19. The semiconductor device of claim 16 , wherein:
the first die comprises a semiconductor material.
20. The semiconductor device of claim 16 , wherein:
the second encapsulant contacts the entire second surface of the first chip and the under fill is a different material than the second encapsulant.