Solid-state imaging device, method of manufacturing solid-state imaging device, and electronic apparatus
An imaging device includes a plurality of photoelectric conversion elements, a plurality of color filter components having a first color filter component and a second color filter component; a light shielding portion, at least a part of which is disposed between the first and second color filter components in a cross-section view; and a transparent film, at least a first part of which is disposed between the first color filter component and the light shielding portion in the cross-section view. A surface of the transparent film facing to the first and second color filter components is nonplanar, and a thickness of the transparent film is less than a thickness of the light shielding portion.
1. An imaging device comprising:
a plurality of photoelectric conversion elements;
a plurality of color filter components including a first color filter component and a second color filter component;
a light shielding portion, at least a part of the light shielding portion disposed between the first color filter component and the second color filter component in a cross-section view; and
a transparent film, at least a part of the transparent film disposed between the first color filter component and the light shielding portion in the cross-section view, wherein
a surface of the transparent film facing to the first and second color filter components is nonplanar, and
a thickness of the transparent film is less than a thickness of the light shielding portion.
2. The imaging device according to claim 1 , wherein the plurality of photoelectric conversion elements includes a first photoelectric conversion element corresponding to the first color filter component, and a second photoelectric conversion element corresponding to the second color filter component.
3. The imaging device according to claim 1 , further comprising:
a semiconductor substrate having a first side and a second side opposite to the first side, wherein
the first side is a light-incident side, and
the semiconductor substrate includes the plurality of photoelectric conversion elements.
4. The imaging device according to claim 3 , further comprising an insulating film disposed adjacent to the first side.
5. The imaging device according to claim 4 , wherein the insulating film is disposed between the transparent film and the first side in the cross-section view.
6. The imaging device according to claim 1 , wherein the transparent film is in contact with the first and second color filter components.
7. The imaging device according to claim 1 , further comprising an element isolation region disposed between adjacent ones of the plurality of photoelectric conversion elements.
8. The imaging device according to claim 1 , wherein the transparent film includes an adhesive film.
9. The imaging device according to claim 1 , wherein the first and second color filters are planarized.
10. The imaging device according to claim 1 , further comprising:
a first microlens disposed on the first color filter component, and
a second microlens disposed on the second color filter component.
11. The imaging device according to claim 1 , wherein the transparent film includes a material selected from the group including an acrylic resin, a phenolic resin, a siloxane resin, a copolymer thereof, and an epoxy resin.
12. The imaging device according to claim 1 , wherein the transparent film comprises an oxide film.
13. The imaging device according to claim 12 , wherein the oxide film is provided on one surface of the light shielding portion.
14. The imaging device according to claim 1 , wherein a thickness of respective ones of the plurality of color filter components is 100 nm to 1 μm.
15. The imaging device according to claim 1 , wherein the plurality of color filter components include filters of at least two different colors selected from green, red, and blue.
16. The imaging device according to claim 1 , wherein the plurality of color filter components includes an ND filter.
17. The imaging device according to claim 1 , wherein the transparent film comprises a nitride film.
18. The imaging device according to claim 1 , wherein the light shielding portion includes a material selected from the group consisting of aluminum and tungsten.
19. The imaging device according to claim 1 , wherein the light shielding portion includes a material selected from the group consisting of carbon black and titanium black.
20. An electronic apparatus, comprising:
an imaging device including:
a plurality of photoelectric conversion elements;
a plurality of color filter components including a first color filter component and a second color filter component;
a light shielding portion, at least a part of the light shielding portion disposed between the first color filter component and the second color filter component in a cross-section view; and
a transparent film, at least a part of the transparent film disposed between the first color filter component and the light shielding portion in the cross-section view, wherein
a surface of the transparent film facing to the first and second color filter components is nonplanar, and
a thickness of the transparent film is less than a thickness of the light shielding portion.
21. The electronic apparatus according to claim 20 , wherein the plurality of photoelectric conversion elements includes a first photoelectric conversion element corresponding to the first color filter component, and a second photoelectric conversion element corresponding to the second color filter component.
22. The electronic apparatus according to claim 20 , further comprising:
a semiconductor substrate having a first side and a second side opposite to the first side, wherein
the first side is a light-incident side, and
the semiconductor substrate includes the plurality of photoelectric conversion elements.
23. The electronic apparatus according to claim 22 , further comprising an insulating film disposed adjacent to the first side.
24. The electronic apparatus according to claim 23 , wherein the insulating film is disposed between the transparent film and the first side in the cross-section view.
25. The electronic apparatus according to claim 20 , wherein the transparent film is in contact with the first and second color filter components.
26. The electronic apparatus according to claim 20 , wherein the transparent film includes an adhesive film.
27. The electronic apparatus according to claim 20 , wherein the transparent film comprises an oxide film provided on one surface of the light shielding portion.
28. The electronic apparatus according to claim 20 , wherein the transparent film comprises a nitride film.
29. The electronic apparatus according to claim 20 , wherein the light shielding portion includes a material selected from the group consisting of aluminum and tungsten.