Semiconductor device and manufacturing method thereof
View Patent ↗A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide methods for manufacturing a semiconductor device, and semiconductor devices produced thereby, that comprise forming an interposer including a reinforcement layer.
1. A method of manufacturing a semiconductor device, the method comprising:
providing a substrate structure comprising:
a substrate that is free of conductive via structures;
a substrate dielectric layer on the substrate; and
a substrate conductive layer on the substrate;
forming an interposer structure on a first side of the substrate structure, the interposer structure comprising:
an interposer dielectric layer; and
an interposer conductive layer;
after said forming an interposer structure, thinning the substrate to remove a first portion of the substrate from a second side of the substrate structure such that a second portion of the substrate remains, wherein said thinning the substrate comprises thinning the substrate without exposing conductive material at the second side of the substrate structure;
after said thinning the substrate, forming a signal distribution structure on the second side of the substrate structure opposite the first side of the substrate structure, wherein the signal distribution structure comprises an under bump metal structure; and
attaching a semiconductor die to the interposer structure.
2. The method of claim 1 , wherein:
the substrate structure is on a first side of the interposer structure; and
said attaching a semiconductor die to the interposer structure comprises, after said thinning the substrate, attaching the semiconductor die on a second side of the interposer structure opposite the first side of the interposer structure.
3. The method of claim 1 , wherein after said attaching a semiconductor die to the interposer structure, the semiconductor die is on a side of the interposer structure opposite the substrate dielectric layer and the substrate conductive layer.
4. The method of claim 1 , comprising, after said thinning the substrate to remove the first portion of the substrate:
forming an aperture through the second portion of the substrate to expose the substrate conductive layer; and
forming the signal distribution structure on the substrate conductive layer exposed through the aperture.
5. The method of claim 1 , wherein the substrate comprises a silicon substrate.
6. The method of claim 5 , wherein the substrate dielectric layer comprises an inorganic dielectric layer, and the interposer dielectric layer comprises an organic dielectric layer.
7. The method of claim 6 , wherein the interposer conductive layer has a finer pitch than the substrate conductive layer.
8. The method of claim 1 , wherein said thinning the substrate to remove a first portion of the substrate comprises mechanically grinding the substrate.
9. The method of claim 1 , wherein the substrate comprises one or more of: glass and/or ceramic.
10. A method of manufacturing a semiconductor device, the method comprising:
providing a first signal distribution structure comprising:
a substrate that is free of conductive via structures;
a first dielectric layer on the substrate; and
a first conductive layer on the substrate;
forming a second signal distribution structure on a first side of the first signal distribution structure, the second signal distribution structure comprising:
a second dielectric layer; and
a second conductive layer;
after said forming the second signal distribution structure, removing a first portion of the substrate from the first signal distribution structure such that a second portion of the substrate remains;
attaching a semiconductor die to the second signal distribution structure; and
forming a third signal distribution structure on a second side of the first signal distribution structure opposite the first side of the first signal distribution structure, wherein the third signal distribution structure comprises an under bump metal structure.
11. The method of claim 10 , comprising attaching a package interconnection structure to the third signal distribution structure.
12. The method of claim 10 , wherein said forming the third signal distribution structure on the second side of the first signal distribution structure comprises:
forming an aperture through the second portion of the substrate to expose the second side of the first signal distribution structure; and
forming at least a portion of the third signal distribution structure in the aperture.
13. The method of claim 10 , wherein said forming a second signal distribution structure is performed before said attaching a semiconductor die, and said forming a third signal distribution structure is performed before said attaching a semiconductor die.
14. The method of claim 10 , wherein said forming a third signal distribution structure on a second side of the first signal distribution structure comprises forming the third signal distribution structure directly on the second side of the first signal distribution structure.
15. The method of claim 14 , wherein the first dielectric layer comprises an inorganic dielectric layer.
16. A method of manufacturing a semiconductor package, the method comprising:
providing a first signal distribution structure comprising:
a substrate;
a first dielectric layer directly on the substrate; and
a first conductive layer directly on the substrate;
forming a second signal distribution structure on a first side of the first signal distribution structure, the second signal distribution structure comprising:
a second dielectric layer; and
a second conductive layer;
after said forming the second signal distribution structure, removing a first portion of the substrate from the first signal distribution structure such that a second portion of the substrate remains, wherein prior to said removing, the first portion of the substrate and the second portion of the substrate are portions of a same continuous layer of substrate material;
after said removing the first portion of the substrate, forming a third signal distribution structure on a second side of the first signal distribution structure opposite the first side of the first signal distribution structure, wherein the third signal distribution structure comprises an under bump metal structure; and
attaching a semiconductor die to the second signal distribution structure,
wherein the second signal distribution structure is between the semiconductor die and the first dielectric layer.
17. The method of claim 16 , wherein said removing a first portion of the substrate is performed before said attaching a semiconductor die.
18. The method of claim 16 , comprising after said removing a first portion of the substrate:
forming an aperture through the second portion of the substrate; and
connecting the third signal distribution structure to the first conductive layer through the aperture.
19. The method of claim 16 , wherein the substrate comprises a silicon substrate.
20. The method of claim 16 , wherein the first dielectric layer comprises an inorganic dielectric layer and the second dielectric layer comprises an organic dielectric layer.