IP Library Granted Patent US 9,772,799
Granted Patent B2
US 9,772,799 · App. 14/981,307 · Granted Sep 26, 2017

Memory interface signal reduction

Inventor: Bill Nale (Livermore, CA)
Assignee: INTEL CORPORATION
G06F3/0659G06F3/061G06F3/0673G11C7/109G11C7/22G11C8/18G11C2207/105
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Quick Facts
Patent No.
US 9,772,799
App. No.
14/981,307
Granted
Sep 26, 2017
Kind
B2
Abstract

In some embodiments a controller includes a memory activate pin, one or more combined memory command/address signal pins, and a selection circuit adapted to select in response to the memory activate pin as each of the one or more combined memory command/address signal pins either a memory command signal or a memory address signal. Other embodiments are described and claimed.

Claims (60)

1. A memory apparatus comprising:

a memory activate contact to receive an activation command signal;

a plurality of address contacts to receive respective memory address signals;

a plurality of multi-function contacts; and

a selection circuit coupled to the memory activate contact and the plurality of multi-function contacts, wherein:

the selection circuit is to interpret signals on the multi-function contacts as additional memory address signals and to implement an activate command if the activation command signal has a first value; and

the selection circuit is to interpret the signals on the multi-function contacts as memory command signals if the activation command signal has a second value.

2. The memory apparatus of claim 1 , wherein the plurality of multi-function contacts includes three contacts.

3. The memory apparatus of claim 1 , wherein the memory command signals include a row address select (RAS) signal, a column address select (CAS) signal, and a write enable (WE) signal.

4. The memory apparatus of claim 1 , wherein the additional memory address signals include an A 14 address signal, an A 15 address signal, and an A 16 address signal.

5. The memory apparatus of claim 1 , wherein the selection circuit is to implement another memory command indicated by the signals on the multi-function contacts if the activation command signal has the second value.

6. The memory apparatus of claim 1 , further comprising a Double Data Rate 4 (DDR4) compliant memory coupled to the selection circuit to implement memory commands encoded by the memory command signals or the signals received on the multi-function contacts.

7. The memory apparatus of claim 1 , wherein the memory activate contact comprises a memory activate pin and the plurality of multi-function contacts comprise a plurality of multi-function pins.

8. A memory controller comprising:

a memory activate contact to provide an activation command signal to a memory;

a plurality of address contacts to provide respective memory address signals to the memory;

a plurality of multi-function contacts; and

a control circuit coupled to the memory activate contact and the plurality of multi-function contacts, wherein:

to indicate an activation command to the memory, the control circuit is to provide the activation command signal with a first value and provide respective additional memory address signals to the memory via the multi-function contacts; and

to indicate a memory command that is different from the activation command to the memory, the control circuit is to provide the activation command signal with a second value and provide respective memory command signals to the memory via the multi-function contacts to indicate the memory command.

9. The memory controller of claim 8 , wherein the plurality of multi-function contacts includes three contacts.

10. The memory controller of claim 8 , wherein the respective memory command signals include a row address select (RAS) signal, a column address select (CAS) signal, and a write enable (WE) signal.

11. The memory controller of claim 8 , wherein the respective additional memory address signals include an A 14 address signal, an A 15 address signal, and an A 16 address signal.

12. The memory controller of claim 8 , wherein the memory comprises a Double Data Rate 4 (DDR4) compliant memory.

13. The memory controller of claim 8 , wherein the memory controller is included on a same die as a processor to enable the processor to communicate with the memory.

14. The memory controller of claim 8 , wherein the memory controller is on a different die than a die of the memory.

15. The memory controller of claim 8 , wherein the memory activate contact comprise a memory activate pin and the plurality of multi-function contacts comprise a plurality of multi-function pins.

16. A system comprising:

a processor;

a memory; and

a memory controller to communicate memory commands to the memory using an activation command signal, a plurality of address signals, and a plurality of multi-function signals, wherein the memory is to interpret the multi-function signals as memory address signals or memory command signals based on whether the activation command signal has a first value or a second value, wherein:

to indicate an activation command to the memory, the memory controller is to provide the activation command signal with a first value and provide respective additional memory address signals to the memory as the multi-function signals; and

to indicate a memory command that is different from the activation command to the memory, the memory controller is to provide the activation command signal with a second value and provide respective memory command signals to the memory as the multi-function signals.

17. The system of claim 16 , wherein the plurality of multi-function signals includes three multi-function signals.

18. The system of claim 16 , wherein the memory command signals include a row address select (RAS) signal, a column address select (CAS) signal, and a write enable (WE) signal.

19. The system of claim 16 , wherein the respective additional memory address signals include an A 14 address signal, an A 15 address signal, and an A 16 address signal.

20. The system of claim 16 , wherein the memory is to receive the activation command signal and the plurality of multi-function signals via respective contacts.

21. The system of claim 16 , wherein the memory comprises a Double Data Rate 4 (DDR4) compliant memory.

22. The system of claim 16 , wherein the memory controller and the processor are included on a same die.

23. The system of claim 16 , wherein the memory controller is included in the processor.

24. The system of claim 16 , wherein the memory controller is on a separate die from the processor.

25. A method to be performed by a memory device, the method comprising:

receiving an activation command signal;

receiving a plurality of memory address signals;

receiving a plurality of multi-function signals;

interpreting the multi-function signals as additional memory address signals and performing an activate operation responsive to a determination that the activation command signal has a first value; and

interpreting the multi-function signals as memory command signals responsive to a determination that the activation command signal has a second value.

26. The method of claim 25 , wherein the activation command signal is received on an activation command contact of the memory device and the multi-function signals are received on respective multi-function contacts of the memory device.

27. The method of claim 25 , wherein the plurality of multi-function signals includes three multi-function signals.

28. The method of claim 25 , wherein the memory command signals include a row address select (RAS) signal, a column address select (CAS) signal, and a write enable (WE) signal.

29. The method of claim 25 , wherein the additional memory address signals include an A 14 address signal, an A 15 address signal, and an A 16 address signal.

30. The method of claim 25 , further comprising performing a memory operation other than the activate operation, as indicated by the multi-function signals, if the activation command signal has the second value.

31. The method of claim 25 , wherein the memory device comprises a Double Data Rate 4 (DDR4) compliant memory device.

32. A method to be performed by a memory controller, the method comprising:

providing an activation command signal with a first value to an activation command contact of a memory and providing a plurality of memory address signals to respective multi-function contacts of the memory to indicate an activation command to the memory; and

providing the activation command signal with a second value to the activation command contact and providing a plurality of memory command signals to the respective multi-function contacts to indicate a memory command that is different from the activation command to the memory.

33. The method of claim 32 , wherein the plurality of memory command signals includes three signals.

34. The method of claim 32 , wherein the memory command signals include a row address select (RAS) signal, a column address select (CAS) signal, and a write enable (WE) signal.

35. The method of claim 32 , wherein the memory address signals include an A 14 address signal, an A 15 address signal, and an A 16 address signal.

36. The method of claim 32 , wherein the memory comprises a Double Data Rate 4 (DDR4) compliant memory.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 6, 2020
From: INTEL CORPORATION
To: SONY CORPORATION
Reel/Frame 054340/0280 →
Continuity (2)
Continuation 12974057 · Dec 21, 2010
Related Publication 20160188258A1 · Jun 30, 2016