CMOS FinFET device having strained SiGe fins and a strained Si cladding layer on the NMOS channel
Techniques and methods related to strained NMOS and PMOS devices without relaxed substrates, systems incorporating such semiconductor devices, and methods therefor may include a semiconductor device that may have both n-type and p-type semiconductor bodies. Both types of semiconductor bodies may be formed from an initially strained semiconductor material such as silicon germanium. A silicon cladding layer may then be provided at least over or on the n-type semiconductor body. In one example, a lower portion of the semiconductor bodies is formed by a Si extension of the wafer or substrate. By one approach, an upper portion of the semiconductor bodies, formed of the strained SiGe, may be formed by blanket depositing the strained SiGe layer on the Si wafer, and then etching through the SiGe layer and into the Si wafer to form the semiconductor bodies or fins with the lower and upper portions.
1. A semiconductor device, comprising:
a substrate having a (110) crystal orientation facing a channel flow direction, and a (110) upper surface;
at least one p-type semiconductor body and at least one n-type semiconductor body both disposed on the substrate and both having a strained semiconductor material comprising SiGe, the individual semiconductor bodies having a channel region disposed between a source region and a drain region;
a strained cladding layer disposed on the channel region of the at least one n-type semiconductor body and being made of silicon (Si), wherein no cladding layer exists on the at least one p-type semiconductor body;
a gate dielectric layer disposed over the cladding layer;
a gate electrode disposed over the gate dielectric layer; and
source or drain material respectively disposed in each of the source and drain regions.
2. The semiconductor device of claim 1 wherein the semiconductor bodies comprise a lower portion formed from Si extensions of the substrate, having the crystal structure of the substrate, and (100) crystal sidewall surfaces, and an upper portion on the lower portion and comprising SiGe.
3. The semiconductor device of claim 1 wherein both the p-type and n-type semiconductor bodies comprise an upper portion that is substantially uniformly SiGe.
4. The semiconductor device of claim 1 wherein the p-type semiconductor bodies have an inner region of Si, and wherein a layer of SiGe is disposed over the inner region.
5. The semiconductor device of claim 1 wherein the n-type semiconductor bodies have an upper portion with a SiGe inner core, and the p-type semiconductor devices have an upper portion with a Si inner core.
6. The semiconductor device of claim 1 wherein the source and drain regions comprise at least one of:
the same material as the cladding layer on the same semiconductor body, and
a filler material disposed at a space formed by removing material from one or more source and/or drain regions of the semiconductor bodies, and wherein the semiconductor bodies have a relaxation causing free surface formed by the removal.
7. The semiconductor device of claim 1 wherein the semiconductor bodies comprise a lower portion formed from Si extensions of the substrate, having the crystal structure of the substrate, and (100) crystal sidewall surfaces, and an upper portion on the lower portion and comprising SiGe,
wherein both the p-type and n-type semiconductor bodies comprise an upper portion that is substantially uniformly SiGe,
wherein the n-type semiconductor bodies have an upper portion with a SiGe inner core, and the p-type semiconductor devices have an upper portion with a Si inner core, and
wherein the source and drain regions comprise at least one of:
the same material as the cladding layer on the same semiconductor body, and
a filler material disposed at a space formed by removing material from one or more source and/or drain regions of the semiconductor bodies, and wherein the semiconductor bodies having a relaxation causing free surface formed by the removal.
8. A mobile computing platform comprising:
a microprocessor comprising:
a substrate having a (110) crystal orientation facing a channel flow direction, and a (110) upper surface;
at least one p-type semiconductor body and at least one n-type semiconductor body both disposed on the substrate and both having a strained semiconductor material comprising SiGe, the individual semiconductor bodies having a channel region disposed between a source region and a drain region;
a strained cladding layer disposed on the channel region of the at least one n-type semiconductor body and being made of silicon (Si)), wherein no cladding layer exists on the at least one p-type semiconductor body;
a gate dielectric disposed layer over the cladding layer;
a gate electrode disposed over the gate dielectric layer; and
source or drain material respectively disposed in each of the source and drain regions;
a display screen communicatively coupled to the microprocessor; and
a wireless transceiver communicatively coupled to the microprocessor.
9. The platform of claim 8 wherein the semiconductor bodies comprise a lower portion formed from Si extensions of the substrate, having the crystal structure of the substrate, and (100) crystal sidewall surfaces, and an upper portion on the lower portion and comprising SiGe,
wherein both the p-type and n-type semiconductor bodies comprise an upper portion that is substantially uniformly SiGe,
wherein the n-type semiconductor bodies have an upper portion with a SiGe inner core, and the p-type semiconductor devices have an upper portion with a Si inner core, and
wherein the source and drain regions comprise at least one of:
the same material as the cladding layer on the same semiconductor body, and
a filler material disposed at a space formed by removing material from one or more source and/or drain regions of the semiconductor bodies, and wherein the semiconductor bodies having a relaxation causing free surface formed by the removal.
10. The platform of claim 8 wherein the strained semiconductor material of the at least one p-type semiconductor body and the at least one n-type semiconductor body both comprise an at least initially strained semiconductor material, and wherein the strained semiconductor material of the at least one p-type semiconductor body and the at least one n-type semiconductor body both comprise a strained upper portion.