IP Library Granted Patent US 9,685,482
Granted Patent B2
US 9,685,482 · App. 15/052,574 · Granted Jun 20, 2017

Image sensor with buried-channel drain (BCD) transistors

Inventor: Eric Stevens (Webster, NY)
Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
H01L27/14887H01L27/14636H01L27/14643H01L27/14689H01L27/14837H01L29/76816H01L29/76833H04N5/378
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Quick Facts
Patent No.
US 9,685,482
App. No.
15/052,574
Granted
Jun 20, 2017
Kind
B2
Abstract

A charge-coupled device (CCD) image sensor is provided. The CCD image sensor may include an array of photosensors that transfer charge to multiple vertical CCD shift registers, which then in turn transfer the charge to a horizontal CCD shift register. The horizontal CCD shift register then feeds an output buffer circuit. The output buffer circuit can include a load transistor implemented using a buried-channel drain (BCD) structure. The load transistor may include a gate conductor, a source diffusion region, a drain diffusion region, and a buried-channel drain region that at least partially extends under the gate conductor. The BCD region may be formed before or after the formation of the gate conductor. If desired, the BCD region can also be formed at the source edge. An image sensor configured in this way can exhibit higher source-drain breakdown voltages, enhanced amplifier gain, and reduced amplifier glow.

Claims (12)

1. An image sensor, comprising:

photosensitive elements that generate charge; and

an output buffer circuit that receives the charge from the photosensitive elements and that includes a load transistor, wherein the load transistor includes a gate conductor and a buried-channel drain region that extends partially beneath only a portion of the gate conductor.

2. The image sensor of claim 1 , wherein the output buffer circuit includes a source-follow transistor coupled in series with the load transistor, and wherein the gate conductor of the load transistor receives a fixed bias voltage signal.

3. The image sensor of claim 1 , wherein the gate conductor overlaps with at least a portion of the buried-channel drain region.

4. The image sensor of claim 1 , wherein the buried-channel drain region has a first portion that is covered by the gate conductor and a second portion that is not covered by the gate conductor.

5. The image sensor of claim 4 , wherein the first and second portions of the buried-channel region have different lengths.

6. The image sensor of claim 4 , wherein the first and second portions of the buried-channel region have identical lengths.

7. The image sensor of claim 4 , wherein the first and second portions of the buried-channel region have different dopant concentrations.

8. The image sensor of claim 4 , wherein the first and second portions of the buried-channel region have identical dopant profiles.

9. The image sensor of claim 1 , wherein the load transistor has a symmetrical source and drain transistor structure.

10. The image sensor of claim 1 , wherein the load transistor has an asymmetric source and drain transistor structure.

Assignments (4)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2016
From: STEVENS, ERIC
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 037818/0293 →
Continuity (2)
Provisional Application 62130083 · Mar 9, 2015
Related Publication 20160268335A1 · Sep 15, 2016