Optoelectronic semiconductor component
An optoelectronic semiconductor component including an optoelectronic semiconductor chip having a first surface, wherein the first surface is a radiation emission surface of the optoelectronic semiconductor chip, the semiconductor chip is embedded in a mold body, the first surface is elevated with respect to a top side of the mold body, and a reflective layer is arranged on the top side of the mold body.
1. A method of producing an optoelectronic semiconductor component comprising:
arranging a first surface of an optoelectronic semiconductor chip on a carrier;
casting a material from a matrix in which dispersive particles are embedded around the semiconductor chip;
arranging a first foil at a second surface of the semiconductor chip; and
injecting a mold material between the matrix material and the first foil to embed the semiconductor chip in a mold body made of the mold material.
2. The method according to claim 1 , wherein a lateral surface of the semiconductor chip is coated with a parting agent prior to casting the material around the semiconductor chip with.
3. The method according to claim 1 , wherein a foil made of ethylene tetrafluoroethylene is the first foil.
4. The method according to claim 1 , wherein the first surface is formed by a surface of an epitaxy layer of the semiconductor chip.
5. The method according to claim 1 , wherein a plurality of optoelectronic semiconductor chips is arranged on the carrier.