Stacked chip-on-board module with edge connector

1. A module, comprising:

a module card having first and second opposed surfaces and an aperture extending between the first and second surfaces, each of the first and second surfaces extending in a first direction and a second direction transverse to the first direction, and a plurality of parallel exposed edge contacts adjacent an edge of at least one of the first and second surfaces configured to mate with corresponding contacts of a socket;

first and second microelectronic elements, the first microelectronic element having a rear surface facing the first surface of the module card, a front surface opposite therefrom, and a lateral edge extending between the front and rear surfaces of the first microelectronic element and extending in the second direction, the second microelectronic element having a front surface facing the first surface of the module card, each microelectronic element being electrically connected to the module card, the second microelectronic element partially overlying the front surface of the first microelectronic element and attached thereto, the front surface of the second microelectronic element projecting in the first direction beyond the lateral edge, chip contacts of the second microelectronic element being exposed at the front surface of the second microelectronic element and disposed beyond the lateral edge,

the second microelectronic element having first and second opposed edges extending between the front surface and a rear surface of the second microelectronic element and extending in the second direction, the front surface of the second microelectronic element having a first outer region adjacent the first edge, a second outer region adjacent the second edge, and a central region disposed between the first and second outer regions, each of the first and second outer regions and the central region having equal width such that the central region extends a middle third of a distance between the first and second edges, the chip contacts of the second microelectronic element being disposed in the central region; and

a plurality of leads extending from chip contacts of the second microelectronic element to the edge contacts, the plurality of leads including first wire bonds extending through the aperture and coupled to the chip contacts of the second microelectronic element.

2. The module as claimed in claim 1 , wherein chip contacts of the first microelectronic element are exposed within a central region of the front surface of the first microelectronic element.

3. The module as claimed in claim 1 , wherein the first microelectronic element has a second edge opposed to the lateral edge, the front surface of the first microelectronic element and the lateral and second edges of the first microelectronic element being such that:

the front surface has a first outer region adjacent the lateral edge of the first microelectronic element, a second outer region adjacent the second edge of the first microelectronic element, and a central region disposed between the first and second outer regions of the front surface of the first microelectronic element, each of the first and second outer regions and the central region having equal width such that the central region of the first microelectronic element extends a middle third of a distance between the lateral and second edges, wherein the chip contacts of the first microelectronic element are disposed in such central region.

4. The module as claimed in claim 1 , wherein the first microelectronic element has a second edge opposed to the lateral edge, the front surface of the first microelectronic element and the lateral and second edges of the first microelectronic element being such that:

the front surface has a first outer region adjacent the lateral edge of the first microelectronic element, a second outer region adjacent the second edge of the first microelectronic element, and a central region disposed between the first and second outer regions of the front surface of the first microelectronic element, each of the first and second outer regions and the central region having equal width such that the central region of the first microelectronic element extends a middle third of a distance between the lateral and second edges, wherein the chip contacts of the first microelectronic element are disposed in such second outer region.

5. The module as claimed in claim 4 , wherein the chip contacts of the first microelectronic element are arranged in one or two parallel rows adjacent the second edge of the first microelectronic element.

6. The module as claimed in claim 1 , wherein at least one of the first and second microelectronic elements includes a memory storage element.

7. The module as claimed in claim 6 , wherein the plurality of leads is a first plurality of leads, the module further comprising a second plurality of leads extending from chip contacts of the first microelectronic element to the edge contacts, the first and second pluralities of leads being configured to carry an address signal usable to address the memory storage element in at least one of the first and second microelectronic elements.

8. The module as claimed in claim 1 , wherein the plurality of leads is a first plurality of leads, the module further comprising a second plurality of leads extending from chip contacts of the first microelectronic element to the edge contacts, the second plurality of leads including conductive elements on the module card and second wire bonds extending from the conductive elements to the chip contacts of the first second microelectronic element.

9. The module as claimed in claim 1 , further comprising a plurality of third microelectronic elements, each third microelectronic element being electrically connected to the module card.

10. The module as claimed in claim 9 , wherein the plurality of third microelectronic elements are arranged in a stacked configuration, each of the third microelectronic elements having a front or rear surface confronting a front or rear surface of an adjacent one of the third microelectronic elements.

11. The module as claimed in claim 9 , wherein the plurality of third microelectronic elements are arranged in a planar configuration, each of the third microelectronic elements having a peripheral surface confronting a peripheral surface of an adjacent one of the third microelectronic elements.

12. The module as claimed in claim 9 , wherein the second microelectronic element includes volatile RAM, the third microelectronic elements each include nonvolatile flash memory, and the first microelectronic element includes a processor configured to predominantly control transfers of data between an external component and the second and third microelectronic elements.

13. The module as claimed in claim 9 , wherein the second microelectronic element includes a volatile frame buffer memory storage element, the third microelectronic elements each include nonvolatile flash memory, and the first microelectronic element includes a graphics processor.

14. A component including first and second modules bonded to one another, each module comprising:

a module card having first and second opposed surfaces and an aperture extending between the first and second surfaces, each of the first and second surfaces extending in a first direction and a second direction transverse to the first direction, and a plurality of parallel exposed edge contacts adjacent an edge of at least one of the first and second surfaces configured to mate with corresponding contacts of a socket;

first and second microelectronic elements, the first microelectronic element having a rear surface facing the first surface of the module card, a front surface opposite therefrom, and a lateral edge extending between the front and rear surfaces of the first microelectronic element and extending in the second direction, the second microelectronic element having a front surface facing the first surface of the module card, each microelectronic element being electrically connected to the module card, the second microelectronic element partially overlying the front surface of the first microelectronic element and attached thereto, the front surface of the second microelectronic element projecting in the first direction beyond the lateral edge, chip contacts of the second microelectronic element being exposed at the front surface of the second microelectronic element and disposed beyond the lateral edge,

the second microelectronic element having first and second opposed edges extending between the front surface and a rear surface of the second microelectronic element and extending in the second direction, the front surface of the second microelectronic element having a first outer region adjacent the first edge, a second outer region adjacent the second edge, and a central region disposed between the first and second outer regions, each of the first and second outer regions and the central region having equal width such that the central region extends a middle third of a distance between the first and second edges, the chip contacts of the second microelectronic element being disposed in the central region; and

a plurality of leads extending from chip contacts of the second microelectronic element to the edge contacts, the plurality of leads including first wire bonds extending through the aperture and coupled to the chip contacts of the second microelectronic element,

wherein the second surfaces of the module cards face one another.