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App. No. 15/061,747 · Confirmation No. 1021

INTERCONNECT STRUCTURE FOR MOLDED IC PACKAGES

Abandoned -- Failure to Respond to an Office Action View Publication ↗
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 Code Description Pages PDF
2016-12-29 ABN Abandonment 2 View
2016-06-30 NTC.PUB Notice of Publication 1 View
2016-06-06 CTNF Non-Final Rejection 10 View
2016-06-06 892 List of references cited by examiner 1 View
2016-06-06 BIB Bibliographic Data Sheet 1 View
2016-06-06 FWCLM Index of Claims 1 View
2016-06-06 SRNT Examiner's search strategy and results 21 View
2016-06-06 SRFW Search information including classification, databases and other search related notes 1 View
2016-06-06 1449 List of References cited by applicant and considered by examiner 1 View
2016-03-23 WFEE Fee Worksheet (SB06) 1 View
2016-03-23 APP.FILE.REC Filing Receipt 3 View
2016-03-04 PA.. Power of Attorney 2 View
2016-03-04 WFEE Fee Worksheet (SB06) 2 View
2016-03-04 N417 Electronic Filing System Acknowledgment Receipt 3 View
2016-03-04 IDS Information Disclosure Statement (IDS) Form (SB08) 1 View
2016-03-04 TRNA Transmittal of New Application 1 View
2016-03-04 ADS Application Data Sheet 6 View
2016-03-04 SPEC Specification 13 View
2016-03-04 CLM Claims 3 View
2016-03-04 ABST Abstract 1 View
2016-03-04 DRW Drawings-only black and white line drawings 13 View
2016-03-04 OATH Oath or Declaration filed 2 View
2016-03-04 TRAN.LET Transmittal Letter 1 View
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Quick Facts
App. No.
15/061,747
Filed
2016-03-04
Pub. No.
US20160190057A1
Art Unit
2817