IP Library › Patent Application 61835933
Patent Application Provisional
App. No. 61/835,933 · Confirmation No. 2966

INTERCONNECT STRUCTURE FOR MOLDED IC PACKAGES

Provisional Application Expired
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 Code Description Pages PDF
2014-04-15 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2014-04-07 PA.. Power of Attorney 2 View
2014-04-07 R3.73 Assignee showing of ownership per 37 CFR 3.73 1 View
2014-04-07 N417 Electronic Filing System Acknowledgment Receipt 2 View
2013-07-05 APP.FILE.REC Filing Receipt 3 View
2013-06-17 DRW.SUPP Drawings-black and white line and/or other drawings — View
2013-06-17 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
2013-06-17 ADS Application Data Sheet 6 View
2013-06-17 SPEC Specification 17 View
2013-06-17 CLM Claims 5 View
2013-06-17 ABST Abstract 1 View
2013-06-17 DRW.NONBW Drawings-other than black and white line drawings 13 View
2013-06-17 WFEE Fee Worksheet (SB06) 2 View
2013-06-17 N417 Electronic Filing System Acknowledgment Receipt 2 View
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Quick Facts
App. No.
61/835,933
Filed
2013-06-17