Photonics chip
The present disclosure relates to semiconductor structures and, more particularly, to photonics chips and methods of manufacture. A structure includes: a photonics chip having a grated optical coupler; an interposer attached to the photonics chip, the interposer having a grated optical coupler; an optical epoxy material provided between the grated optical coupler of the photonics chip and the grated optical coupler of the interposer; and epoxy underfill material provided at interstitial regions between the photonics chip and the interposer which lie outside of an area of the grated optical couplers of the photonics chip and the interposer.
1. A structure comprising:
a photonics chip having a grated optical coupler;
an interposer attached to the photonics chip, the interposer having a grated optical coupler;
an optical epoxy material provided within a cavity formed between the grated optical coupler of the photonics chip and the grated optical coupler of the interposer;
epoxy underfill material provided at interstitial regions between the photonics chip and the interposer which lie outside of an area of the grated optical couplers of the photonics chip and the interposer; and
a barrier material which is structured to form the cavity and to maintain the optical epoxy material within the cavity.
2. The structure of claim 1 , wherein the barrier material is a cured underfill material.
3. The structure of claim 2 , wherein the optical epoxy material is a low viscosity optical epoxy material, compared to the cured underfill material.
4. The structure of claim 1 , wherein the epoxy underfill material is a polymer material with a coefficient of thermal expansion (CTE) that substantially matches the CTE of the photonics chip and the interposer.
5. The structure of claim 1 , wherein the optical epoxy material is localized within an optical transmission region of the grated optical couplers of the photonics chip and the interposer.
6. The structure of claim 1 , wherein the optical epoxy material and the epoxy underfill material are flowable materials.
7. A structure, comprising:
a photonics chip mounted to an interposer with a plurality of solder connections;
at least one cavity formed between the photonics chip and the interposer;
grated optical couplers provided on opposing sides of the at least one cavity;
at least one waveguide structure providing an optical transmission to the grated optical couplers;
an optical fiber coupled to the waveguide structure;
an optical epoxy material provided within the at least one cavity between the grated optical couplers; and
epoxy underfill material provided at interstitial regions between the plurality of solder connections.
8. The structure of claim 7 , wherein the at least one cavity is at least partly surrounded by a barrier material.
9. The structure of claim 8 , wherein the barrier material is a no or low flow underfill material.
10. The structure of claim 9 , wherein the no or low flow underfill material is a polymer material.
11. The structure of claim 10 , wherein the polymer material is a cured material which prevents the optical epoxy material from exiting from the at least one cavity.
12. The structure of claim 11 , wherein the optical epoxy material is a low viscosity optical epoxy material, compared to the cured underfill material.
13. The structure of claim 7 , wherein the optical epoxy material is localized within an optical transmission region of the grated optical couplers of the photonics chip and the interposer.
14. The structure of claim 7 , wherein the optical epoxy material and the epoxy underfill material are flowable materials.
15. The structure of claim 1 , wherein the grated optical coupler of the photonics chip and the grated optical coupler of the interposer are provided on opposing sides of the cavity.
16. The structure of claim 15 , further comprising at least one waveguide structure providing an optical transmission to the grated optical couplers and an optical fiber coupled to the waveguide structure.
17. The structure of claim 1 , wherein:
the barrier material is composed of a low or no-flow underfill polymer material that does not flow during attachment of the interposer to the photonics chip,
the barrier material is UV cured and has a CTE that substantially matches to the CTE of both the interposer and the photonics chip,
the barrier material is different than the optical epoxy, and
the epoxy material is a flowable material.