Insulating film, method for manufacturing semiconductor device, and semiconductor device
In a semiconductor device including a transistor including an oxide semiconductor film and a protective film over the transistor, an oxide insulating film containing oxygen in excess of the stoichiometric composition is formed as the protective film under the following conditions: a substrate placed in a treatment chamber evacuated to a vacuum level is held at a temperature higher than or equal to 180° C. and lower than or equal to 260° C.; a source gas is introduced into the treatment chamber so that the pressure in the treatment chamber is set to be higher than or equal to 100 Pa and lower than or equal to 250 Pa; and a high-frequency power higher than or equal to 0.17 W/cm 2 and lower than or equal to 0.5 W/cm 2 is supplied to an electrode provided in the treatment chamber.
1. A semiconductor device comprising:
a first gate electrode;
an oxide semiconductor film comprising indium, gallium, and zinc over the first gate electrode;
a second gate electrode comprising a first conductive film and a second conductive film over the oxide semiconductor film; and
a protective film over the second gate electrode,
wherein an indium concentration is larger than a gallium concentration in the oxide semiconductor film,
wherein the first conductive film comprises indium, zinc, and oxide,
wherein the second conductive film comprises a metal element, and
wherein the protective film is an oxide insulating film in which a spin density of a signal at g=2.001, measured by electron spin resonance, is lower than 1.5×10 18 spins/cm 3 .
2. The semiconductor device according to claim 1 , wherein the second conductive film is over the first conductive film.
3. The semiconductor device according to claim 1 , wherein the metal element is one selected from the group consisting of aluminum, titanium, tantalum, tungsten, and molybdenum.
4. The semiconductor device according to claim 1 , wherein an atomic ratio of indium, gallium, and zinc of the oxide semiconductor film is 4:2:3.
5. The semiconductor device according to claim 1 , wherein the oxide semiconductor film comprises a c-axis aligned crystal part.
6. The semiconductor device according to claim 1 , wherein a hydrogen concentration of the oxide semiconductor film is lower than 5×10 19 atoms/cm 3 .
7. A semiconductor device comprising:
a first gate electrode;
a first oxide semiconductor film comprising indium, gallium, and zinc over the first gate electrode;
a second oxide semiconductor film comprising indium, gallium, and zinc over the first oxide semiconductor film;
a second gate electrode comprising a first conductive film and a second conductive film over the second oxide semiconductor film; and
a protective film over the second gate electrode,
wherein an indium concentration is larger than a gallium concentration in the second oxide semiconductor film,
wherein the first conductive film comprises indium, zinc, and oxide,
wherein the second conductive film comprises a metal element, and
wherein the protective film is an oxide insulating film in which a spin density of a signal at g=2.001, measured by electron spin resonance, is lower than 1.5×10 18 spins/cm 3 .
8. The semiconductor device according to claim 7 , wherein the second conductive film is over the first conductive film.
9. The semiconductor device according to claim 7 , wherein the metal element is one selected from the group consisting of aluminum, titanium, tantalum, tungsten, and molybdenum.
10. The semiconductor device according to claim 7 , wherein an atomic ratio of indium, gallium, and zinc of the first oxide semiconductor film is 1:3:2.
11. The semiconductor device according to claim 7 , wherein an atomic ratio of indium, gallium, and zinc of the second oxide semiconductor film is 4:2:3.
12. The semiconductor device according to claim 7 , wherein at least one of the first oxide semiconductor film and the second oxide semiconductor film comprises a c-axis aligned crystal part.
13. The semiconductor device according to claim 7 , wherein a hydrogen concentration of the second oxide semiconductor film is lower than 5×10 19 atoms/cm 3 .