IP Library Granted Patent US 10,283,945
Granted Patent B2
US 10,283,945 · App. 15/078,473 · Granted May 7, 2019

Load center thermally conductive component

Inventor: Peter James Fritz (Williamston, MI)
Assignee: EATON INTELLIGENT POWER LIMITED
H02B1/56H02G3/03
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,283,945
App. No.
15/078,473
Granted
May 7, 2019
Kind
B2
Abstract

Devices and systems for dissipating heat generated from heat generating components in a load center are provided herein. The disclosed concept provides a heat dissipating component that assists in heat dissipation of a heat generating component in a load center by transferring heat from the heat generating component to a non-heat generating component.

Claims (39)

1. A load center comprising:

a heat generating component;

a non-heat generating component formed of a thermally conductive material;

a heat dissipating component formed of a dielectric material positioned in between the heat generating component and the non-heat generating component and being thermally coupled to both the heat generating component and the non-heat generating component; and

an insulator structured to provide thermal insulation for at least a portion of the heat generating component,

wherein the heat dissipating component is at least partially located within the insulator,

wherein the non-heat generating component is an enclosure; and

wherein the insulator is spaced from the enclosure to form an air gap therebetween in an interior of the enclosure.

2. The load center of claim 1 , wherein heat generated by the heat generating component is communicated to the enclosure via the heat dissipating component, and wherein electrical current conducted by heat generating component is attenuated by the heat dissipating component.

3. The load center of claim 2 , wherein the enclosure is electrically conductive.

4. The load center of claim 1 , wherein the dielectric material comprises at least one of: boron nitride and aluminum nitride.

5. The load center of claim 1 , wherein the heat generating component is a bus bar.

6. The load center of claim 1 , wherein the insulator comprises a reinforced polymer formed of at least one of: fiberglass, silica, and aluminum-tri-hydrate.

7. The load center of claim 5 , further comprising:

a circuit breaker that is electrically coupled to the bus bar and thermally coupled to the heat dissipating component.

8. The load center of claim 5 , wherein the bus bar is formed of at least one of: copper and aluminum.

9. The load center of claim 1 , wherein the heat dissipating component is mechanically coupled to at least one of: the heat generating component and the enclosure.

10. The load center of claim 1 , further comprising:

a cover configured to encapsulate at least a portion of the heat dissipating component, the cover limiting dissipation of heat for the encapsulated portion of the heat dissipating component.

11. The load center of claim 1 , wherein the heat dissipating component is also spaced from the enclosure to form an air gap therebetween in the interior of the enclosure.

12. The load center of claim 1 , wherein the heat dissipating component protrudes through the enclosure.

13. A system comprising:

a power source;

a load center comprising:

a heat generating component electrically coupled to the power source;

a non-heat generating component formed of a thermally conductive material;

a heat dissipating component formed of a dielectric material positioned in between the heat generating component and the non-heat generating component and being thermally coupled to both the heat generating component and the non-heat generating component;

an insulator structured to provide thermal insulation for at least a portion of the heat generating component,

wherein the heat dissipating component is at least partially located within the insulator,

wherein the non-heat generating component is an enclosure, and

wherein the insulator is spaced from the enclosure to form an air gap therebetween in an interior of the enclosure; and

a structure thermally coupled to the enclosure.

14. The system of claim 13 , wherein the dielectric material comprises at least one of boron nitride and aluminum nitride.

15. The system of claim 13 , wherein the heat generating component is a bus bar.

16. The system of claim 13 , wherein the insulator comprises a reinforced polymer formed of at least one of fiberglass, silica, and aluminum-tri-hydrate.

17. The system of claim 15 , wherein the load center further comprises:

a circuit breaker electrically coupled to the bus bar and thermally coupled to the heat dissipating component.

18. The system of claim 13 , wherein the load center further comprises:

a cover configured to encapsulate at least a portion of the heat dissipating component, the cover limiting dissipation of heat for the encapsulated portion of the heat dissipating component.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 11, 2019
From: EATON CORPORATION
To: EATON INTELLIGENT POWER LIMITED
Reel/Frame 048855/0626 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 14, 2018
From: EATON CORPORATION
To: EATON INTELLIGENT POWER LIMITED
Reel/Frame 047778/0446 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 24, 2016
From: FRITZ, PETER JAMES
To: EATON CORPORATION
Reel/Frame 038090/0016 →
Continuity (1)
Related Publication 20170279253A1 · Sep 28, 2017
Cited By (1)
US 1,118,283