Micromagnetic device and method of forming the same

1. A micromagnetic device formed on a substrate, comprising:

a first insulating layer formed above the substrate;

a first seed layer formed above the first insulating layer, wherein the first seed layer is conductive and configured for electroplating;

a first conductive winding layer electroplated onto the first seed layer;

a first magnetic core layer formed above the first conductive winding layer; and

another insulating layer formed above the first magnetic core layer.

2. The micromagnetic device as recited in claim 1 wherein at least a portion of the first insulating layer and the first conductive winding layer are within a trench of the substrate.

3. The micromagnetic device as recited in claim 1 further comprising a further other insulating layer formed above the first conductive winding layer.

4. The micromagnetic device as recited in claim 1 further comprising a second magnetic core layer formed above the another insulating layer.

5. The micromagnetic device as recited in claim 1 further comprising a second magnetic core layer formed above the another insulating layer and a further other insulating layer formed above the second magnetic core layer.

6. The micromagnetic device as recited in claim 1 further comprising a second magnetic core layer formed above the another insulating layer, a further other insulating layer formed above the second magnetic core layer and a second seed layer formed above the further other insulating layer.

7. The micromagnetic device as recited in claim 1 further comprising a second magnetic core layer formed above the another insulating layer and a protective layer formed above the second magnetic core layer.

8. The micromagnetic device as recited in claim 1 further comprising a second magnetic core layer formed above the another insulating layer, a further other insulating layer formed above the second magnetic core layer, a second seed layer formed above further other insulating layer and a second conductive winding layer formed above the second seed layer.

9. The micromagnetic device as recited in claim 1 further comprising a second conductive winding formed above the another insulating layer.

10. The micromagnetic device as recited in claim 9 wherein the first and second conductive winding layers are formed from copper.

11. The micromagnetic device as recited in claim 1 further comprising a second conductive winding formed above the another insulating layer and in vias to the first conductive winding layer, the first conductive winding layer and the second conductive winding layer forming a winding for the micromagnetic device.

12. The micromagnetic device as recited in claim 1 further comprising an adhesive layer formed above the first insulating layer.

13. The micromagnetic device as recited in claim 1 further comprising a protective layer formed above the first magnetic core layer.

14. The micromagnetic device as recited in claim 1 further comprising a nickel protective layer formed above the first magnetic core layer.

15. The micromagnetic device as recited in claim 1 wherein the first insulating layer is formed from silicon dioxide.

16. The micromagnetic device as recited in claim 1 wherein the another insulating layer is formed from aluminum oxide, silicon dioxide, insulation polymer, photoresist or polyimide.

17. The micromagnetic device as recited in claim 1 wherein the first magnetic core layer is formed from an iron-cobalt alloy or an iron-cobalt-phosphorus alloy.

18. The micromagnetic device as recited in claim 1 wherein the micromagnetic device is an inductor.

19. The micromagnetic device as recited in claim 12 , wherein the adhesive layer comprises apertures and interconnects formed in the apertures of the adhesive layer.

20. The micromagnetic device as recited in claim 19 , wherein the interconnects comprise solder balls.