Repairable rigid test probe card assembly
View Patent ↗A repairable rigid test probe system includes an annular gimbal supported by an annular gimbal bearing of a probe card assembly, a test substrate seated and aligned within the annular gimbal, a rigid die including thick periphery and a thin center containing an array of through holes that is aligned above the test substrate, and an array of rigid probes inserted into each of the array of through holes, where each rigid probe includes: a tail end that contacts a connection on a facing surface of the test substrate, a collar limiting a distance of insertion, and a tip that contacts a corresponding contact on a facing surface of a device under test.
1. A repairable rigid probe card assembly, comprising:
an annular gimbal supported by a single annular gimbal bearing attached to an upper surface of a device interface board of a probe card assembly, the annular gimbal having a convex lateral surface that opposes a concave lateral surface of the single annular gimbal bearing;
a test substrate seated and aligned within the annular gimbal;
a rigid die including a thick periphery and a thin center containing an array of through holes, the rigid die aligned above the test substrate by sides of the test substrate; and
a rigid probe identified for repair, being removed from one of an array of holes in the rigid die, and inserting a new rigid probe into the one of an array of test holes in the rigid die, the rigid probe identified for repair, including: a tail end extending beyond a lower surface of the thin center of the rigid die to contact a connection on an upper surface of the test substrate, a collar abutting a lower surface of the thin center of the rigid die to limit a distance of insertion, and a tip extending beyond an upper surface of the thin center of the rigid die to contact a corresponding contact of an array of contacts on a lower surface of a device under test.
2. The repairable rigid probe card assembly of claim 1 , further comprising an interposer connected by first leads from an upper surface of the interposer to a lower surface of the test substrate and by second leads from a lower surface of the interposer to the upper surface of the device interface board.
3. The repairable rigid probe card assembly of claim 1 , the sides of the test substrate including chamfered sides on an upper portion of the test substrate to align the rigid die and chamfered sides on a lower portion of the test substrate to align the test substrate within the annular gimbal.
4. The repairable rigid probe card assembly of claim 1 , the rigid die comprising one of: a ceramic die and a plastic die.
5. The repairable rigid probe card assembly of claim 1 , each of the array of through holes being chamfered at a lower surface of the rigid die facing the test substrate.
6. The repairable rigid probe card assembly of claim 1 , the array of rigid test probes comprising any of: Paliney® 7; other metal alloys containing any of palladium, platinum, gold, and silver; rhodium; and rhodium alloys.
7. A repairable rigid test probe card assembly, comprising:
an annular gimbal;
a single annular gimbal bearing attached to an upper surface of a device interface board of a probe card assembly;
an annular spring plate, an inner portion of which applies a pre-load to an upper surface of the periphery of the annular gimbal and an outer portion of which is attached to an upper surface of the single annular gimbal bearing;
three, pointed, leveling screws disposed around the periphery of the annular gimbal, tips of the three, pointed, leveling screws resting within a groove formed on a lower surface of the annular spring plate and defining a plane in 3-dimensions relative to the horizontal plane of the upper surface of the annular gimbal bearing;
a rigid test probe identified for repair being one of an array of rigid test probes inserted into a through hole of the array of through holes in a rigid die, the rigid test probe identified for repair, including: a tail end extending beyond a lower surface of a thin center of the rigid die to contact a connection on an upper surface of a test substrate, a collar abutting a lower surface of the thin center of the rigid die to limit a distance of insertion, and a tip extending beyond an upper surface of the thin center of the rigid die to contact a corresponding contact of an array of contacts on a lower surface of a device under test.
8. The repairable rigid test probe card assembly of claim 7 , further comprising an interposer connected by first leads from an upper surface of the interposer to a lower surface of the test substrate and by second leads from a lower surface of the interposer to the upper surface of the device interface board.
9. The repairable rigid test probe card assembly of claim 7 , sides of the test substrate including chamfered sides on an upper portion of the test substrate to align the rigid die and chamfered sides on a lower portion of the test substrate to align the test substrate within the annular gimbal.
10. The repairable rigid test probe card assembly of claim 7 , the rigid die comprising one of: a ceramic die and a plastic die.
11. The repairable rigid test probe card assembly of claim 7 , each of the array of through holes being chamfered at a lower surface of the rigid die facing the test substrate.
12. The repairable rigid test probe card assembly of claim 7 , the array of rigid test probes any of: Paliney® 7; other metal alloys containing any of palladium, platinum, gold, and silver; rhodium; and rhodium alloys.
13. The repairable rigid test probe card assembly of claim 7 , the annular gimbal having a spherical nub along its peripheral edge that opposes a vertically aligned sidewall of the annular gimbal bearing.
14. The repairable rigid test probe card assembly of claim 7 , the annular gimbal having a convex peripheral sidewall that opposes and slides upon a concave sidewall of the annular gimbal bearing.
15. A repairable rigid test probe card assembly, comprising:
an annular gimbal;
a single annular gimbal bearing attached to an upper surface of a device interface board of a probe card assembly;
an annular spring plate, an inner portion of which applies a pre-load to an upper surface of the periphery of the annular gimbal and an outer portion of which is attached to an upper surface of the single annular gimbal bearing;
three, pointed, leveling screws disposed around the periphery of the annular gimbal, tips of the three, pointed, leveling screws resting within a groove formed on a lower surface of the annular spring plate; and
a rigid test probe identified for repair being one of an array of rigid test probes inserted into a through hole of the array of through holes in a rigid die, the rigid test probe identified for repair, including: a tail end extending beyond a lower surface of a thin center of the rigid die to contact a connection on an upper surface of a test substrate, a collar abutting a lower surface of the thin center of the rigid die to limit a distance of insertion, and a tip extending beyond an upper surface of the thin center of the rigid die to contact a corresponding contact of an array of contacts on a lower surface of a device under test.
16. The repairable rigid test probe card assembly of claim 15 , the annular gimbal having a vertically aligned sidewall that opposes and roughly parallels a sidewall of the single annular gimbal bearing.
17. The repairable rigid test probe card assembly of claim 15 , the annular gimbal having a spherical nub along its peripheral edge that opposes a vertically aligned sidewall of the single annular gimbal bearing.
18. The repairable rigid test probe card assembly of claim 15 , further comprising a test substrate seated and aligned within the annular gimbal, and a rigid die aligned above the test substrate by sides of the test substrate.
19. The repairable rigid test probe card assembly of claim 15 , each of the array of through holes being chamfered at a lower surface of the rigid die facing the test substrate.