IP Library › Granted Patent US 10,338,466
Granted Patent B2
US 10,338,466 · App. 15/094,362 · Granted Jul 2, 2019

System and method for planarizing a substrate

Inventor: Anton J. deVilliers (Clifton Park, NY)
Assignee: Tokyo Electron Limited
G03F7/0035G03F7/32G03F7/40G03F7/70291H01L21/0273H01L21/31058
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Quick Facts
Patent No.
US 10,338,466
App. No.
15/094,362
Granted
Jul 2, 2019
Kind
B2
Abstract

Techniques include providing selective or differential planarization such that different regions of a substrate can have different amounts of material removed. In general, methods herein use photo-reactive generator compounds to generate solubility-changing agents. A specific pattern of light is projected onto a substrate containing such photo-reactive generator compounds to create different concentrations of solubility-changing agent(s) at specific locations across a substrate. As generated solubility-changing agents are diffused into an underlying layer, these concentration differences then control an amount (height or depth) of material removed from a given film or layer at specific spatial locations on the substrate.

Claims (29)

1. A method of planarizing a substrate, the method comprising:

receiving a substrate having micro-fabricated structures formed thereon, the micro-fabricated structures being positioned on an upper portion of the substrate, at least a portion of the micro-fabricated structures defining open spaces between each other;

depositing a filler layer of filler material on the substrate, the filler layer filling spaces between the micro-fabricated structures and covering at least a portion of the micro-fabricated structures, the filler layer resulting in a top surface that is non-planar in that top surface locations of the filler layer differ in z-height compared to each other by approximately 1-100 nanometers;

depositing a generator compound on the filler layer, the generator compound being a compound that generates a solubility-changing agent in response to receiving actinic radiation exposure;

projecting a pattern of actinic radiation onto the substrate, the pattern of actinic radiation being projected using a digital pixel-based projection system having an array of independently addressable projection points, the pattern of actinic radiation causing the generator compound to generate the solubility-changing agent such that a concentration of the solubility-changing agent generated at a given point location on the substrate is selectably controlled by an exposure intensity of actinic radiation at the given point location;

causing the solubility-changing agent to diffuse into at least a portion of the filler layer such that the solubility-changing agent changes a solubility of a top portion of the filler layer; and

removing soluble top portions of the filler layer using a developing agent,

wherein projecting the pattern of actinic radiation onto the substrate includes varying an amount of actinic radiation projected onto the substrate based on a z-height signature that spatially characterizes z-height values of the top surface of the filler layer across the substrate.

2. The method of claim 1 , further comprising generating the z-height signature based on a topology of the microfabricated structures on the substrate.

3. The method of claim 1 , wherein depositing the generator compound includes depositing a photo acid generator, and wherein projecting the pattern of actinic radiation causes the photo acid generator to generate a photo acid such that a concentration of the photo acid at a given spatial location on the substrate is based on the z-height signature.

4. The method of claim 1 , wherein projecting the pattern of actinic radiation onto the substrate includes projecting the pattern of actinic radiation based on a z-height signature that spatially characterizes z-height values of the top surface of the filler layer across the substrate such that an amount of solubility-changing agent generated at each projected pixel location on the substrate is based on an intensity of actinic radiation projected at each pixel location.

5. A method of planarizing a substrate, the method comprising:

receiving a substrate having micro-fabricated structures formed thereon, the micro-fabricated structures being positioned on an upper portion of the substrate, at least a portion of the micro-fabricated structures defining open spaces between each other;

depositing a filler layer of filler material on the substrate, the filler layer filling spaces between the micro-fabricated structures and covering at least a portion of the micro-fabricated structures, the filler layer resulting in a top surface that is non-planar in that top surface locations of the filler layer differ in z-height compared to each other by approximately 1-100 nanometers;

depositing a generator compound on the filler layer, the generator compound being a compound that generates a solubility-changing agent in response to receiving actinic radiation exposure;

projecting a pattern of actinic radiation onto the substrate, the pattern of actinic radiation being projected using a digital pixel-based projection system having an array of independently addressable projection points, the pattern of actinic radiation causing the generator compound to generate the solubility-changing agent such that a concentration of the solubility-changing agent generated at a given point location on the substrate is selectably controlled by an exposure intensity of actinic radiation at the given point location; and

causing the solubility-changing agent to diffuse into at least a portion of the filler layer such that the solubility-changing agent changes a solubility of a top portion of the filler layer,

wherein projecting the pattern of actinic radiation onto the substrate includes varying an amount of actinic radiation projected onto the substrate based on a z-height signature that spatially characterizes z-height values of the top surface of the filler layer across the substrate, and

wherein depositing the filler layer of filler material includes depositing a developable material in that the developable material has a solubility shift in response to presence of solubility-changing agents above a predetermined concentration threshold.

6. The method of claim 5 , wherein depositing the filler layer of filler material includes the filler material containing a hard mask material.

7. The method of claim 6 , further comprising using the filler layer as a mask to transfer a filler layer pattern into an underlying layer.

8. A method of planarizing a substrate, the method comprising:

receiving a substrate having micro-fabricated structures formed thereon, the micro-fabricated structures being positioned on an upper portion of the substrate, at least a portion of the micro-fabricated structures defining open spaces between each other;

depositing a filler layer of filler material on the substrate, the filler layer filling spaces between the micro-fabricated structures and covering at least a portion of the micro-fabricated structures, the filler layer resulting in a top surface that is non-planar in that top surface locations of the filler layer differ in z-height compared to each other by approximately 1-100 nanometers;

depositing a generator compound on the filler layer, the generator compound being a compound that generates a solubility-changing agent in response to receiving actinic radiation exposure;

projecting a pattern of actinic radiation onto the substrate, the pattern of actinic radiation being projected using a digital pixel-based projection system having an array of independently addressable projection points, the pattern of actinic radiation causing the generator compound to generate the solubility-changing agent such that a concentration of the solubility-changing agent generated at a given point location on the substrate is selectably controlled by an exposure intensity of actinic radiation at the given point location; and

causing the solubility-changing agent to diffuse into at least a portion of the filler layer such that the solubility-changing agent changes a solubility of a top portion of the filler layer,

wherein projecting the pattern of actinic radiation onto the substrate includes varying an amount of actinic radiation projected onto the substrate based on a z-height signature that spatially characterizes z-height values of the top surface of the filler layer across the substrate, and

wherein causing the solubility-changing agent to diffuse into at least a portion of the filler layer includes baking the substrate at a predetermined time and temperature to result in a predetermined acid diffusion distance into the filler layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 8, 2016
From: DEVILLIERS, ANTON J.
To: TOKYO ELECTRON LIMITED
Reel/Frame 038230/0150 →
Continuity (2)
Provisional Application 62146480 · Apr 13, 2015
Related Publication 20160300726A1 · Oct 13, 2016
Cited By (2)
US 12,625,432 US 12,730,265