Cobalt precursors
Cobalt precursors are described, having application for vapor deposition of cobalt on substrates, such as in atomic layer deposition (ALD) and chemical vapor deposition (CVD) processes for forming interconnects, capping structures, and bulk cobalt conductors, in the manufacture of integrated circuitry and thin film products.
1. A process for depositing cobalt on a substrate, comprising contacting the substrate with cobalt precursor vapor under vapor deposition conditions effective for deposition of cobalt on the substrate, wherein the cobalt precursor comprises a cobalt precursor of the formula: Co 2 (CO) 6 [(F 3 C)C≡C(CF 3 )].
2. The process of claim 1 , wherein a cobalt or cobalt-containing film is deposited on the substrate in said contacting.
3. The process of claim 1 , wherein a cobalt or cobalt-containing thin film is deposited on the substrate in said contacting.
4. The process of claim 1 , wherein the cobalt is deposited on the substrate by chemical vapor deposition.
5. The process of claim 1 , wherein the cobalt is deposited on the substrate by atomic layer deposition.
6. The process of claim 1 , wherein the cobalt is deposited on the substrate by photo-assisted vapor deposition, plasma-assisted vapor deposition, or laser-assisted vapor deposition.
7. The process of claim 1 , wherein the vapor deposition is carried out in a vapor deposition chamber to which the cobalt precursor vapor is flowed.
8. The process of claim 7 , wherein the cobalt precursor vapor is delivered to the vapor deposition chamber by liquid delivery in which the cobalt precursor in a solvent medium is volatilized to form the cobalt precursor vapor.
9. The process of claim 8 , wherein the solvent medium comprises a hydrocarbon solvent.
10. The process of claim 9 , wherein said hydrocarbon solvent comprises an alkane.
11. The process of claim 9 , wherein the hydrocarbon solvent comprises octane.
12. The process of claim 7 , wherein the cobalt precursor vapor is delivered to the vapor deposition chamber by solid delivery in which the cobalt precursor is volatilized from a solid phase to form the cobalt precursor vapor.
13. The process of claim 7 , wherein the cobalt precursor vapor is flowed to the vapor deposition chamber from a cobalt precursor package in which the cobalt precursor is adsorbed on a solid physical adsorbent material, and wherein the cobalt precursor is desorbed under dispensing conditions, for dispensing of the cobalt precursor vapor from the cobalt precursor package for flow to the vapor deposition chamber.
14. The process of claim 7 , wherein the cobalt precursor vapor is flowed to the vapor deposition chamber from a cobalt precursor package in which the cobalt precursor is stored in an ionic liquid medium, and wherein the cobalt precursor is liberated from the ionic liquid medium under dispensing conditions, for dispensing of the cobalt precursor vapor from the cobalt precursor package for flow to the vapor deposition chamber.
15. The process of claim 7 , wherein the cobalt precursor vapor is flowed to the vapor deposition chamber with a co-flow gas.
16. The process of claim 15 , wherein the co-flow gas comprises one or more selected from the group consisting of argon, xenon, krypton, helium, hydrogen, nitrogen, carbon monoxide, oxygen, and carbon dioxide.
17. The process of claim 15 , wherein the co-flow gas comprises a co-flow precursor for concurrent deposition of another metal to form a mixed metal alloy comprising cobalt on the substrate.