Substrate processing system
A substrate processing system for performing a process with respect to a plurality of substrates includes an annular process chamber configured to accommodate the plurality of substrates and to perform a predetermined process on the plurality of substrates, a cassette mounting part configured to mount a cassette which accommodates the plurality of substrates, and a substrate transfer mechanism configured to transfer the plurality of substrates between the annular process chamber and the cassette mounting part. The plurality of substrates is concentrically disposed within the annular process chamber in a plane view.
1. A substrate processing system for performing a process with respect to a plurality of substrates, comprising:
an annular process chamber configured to accommodate the plurality of substrates and to perform a predetermined process on the plurality of substrates, the annular process chamber having an inner lateral surface and an outer lateral surface;
a cassette mounting part configured to mount a cassette which accommodates the plurality of substrates;
a substrate transfer mechanism configured to transfer the plurality of substrates between the annular process chamber and the cassette mounting part; and
a gate valve is installed in the inner lateral surface of the annular process chamber facing the substrate transfer mechanism,
wherein the plurality of substrates is concentrically disposed within the annular process chamber in a plane view,
wherein the substrate transfer mechanism is disposed in a space surrounded by the inner lateral surface of the annular process chamber, and
wherein a vacuum transfer chamber is installed adjacent to the annular process chamber in the space surrounded by the inner lateral surface of the annular process chamber, and the substrate transfer mechanism is disposed within the vacuum transfer chamber.
2. The system of claim 1 , wherein the vacuum transfer chamber and the cassette mounting part are connected to each other via a load lock chamber.
3. The system of claim 2 , wherein the load lock chamber is disposed at an upper side of the annular process chamber, at the lower side of the process chamber, or at both the upper and lower sides of the annular process chamber.
4. The system of claim 3 , wherein an annular mounting table configured to mount the plurality of substrates thereon is installed within the annular process chamber.
5. The system of claim 2 , wherein an annular mounting table configured to mount the plurality of substrates thereon is installed within the annular process chamber.
6. The system of claim 1 , wherein an annular mounting table configured to mount the plurality of substrates thereon is installed within the annular process chamber.