Programmable impedance memory device and related methods
A memory device can include at least one plate structure formed over a semiconductor substrate; an active region formed within the semiconductor substrate without lateral isolation structures; a plurality of bit line contact groups, each including bit line contacts to the active region disposed in a first direction; a plurality of storage contact groups, each including storage contacts to the active region disposed in the first direction; a plurality of gate structures, each including a main section extending in the first direction, and disposed between one bit line contact group and an adjacent storage contact group; and a two-terminal storage element disposed between each bit line contact and the at least one plate structure.
1. A memory device, comprising: at least one plate structure formed over a semiconductor substrate; an active region formed within the semiconductor substrate without lateral isolation structures; a plurality of bit line contact groups, each including bit line contacts to the active region disposed in a first direction; a plurality of storage contact groups, each including storage contacts to the active region disposed in the first direction; to a plurality of gate structures, each including a main section extending in the first direction, and disposed between one bit line contact group and an adjacent storage contact group; and a two-terminal storage element disposed between each bit line contact and the at least one plate structure, wherein each gate structure further includes a plurality of second sections that extend from the main section at least between adjacent storage contacts of the adjacent storage contact group.
2. The memory device of claim 1 , wherein each gate structure further includes a plurality of second sections that laterally surround each storage contact of the adjacent storage contact group.
3. The memory device of claim 1 , wherein the at least one plate structure comprises a plurality of plate structures, each plate structure being electrically connected to a different group of storage elements.
4. The memory device of claim 3 , wherein each plate structure has an elongated shape with longer sides extending in a second direction different than the first direction.
5. The memory device of claim 1 , wherein:
each storage contact comprises structures formed from a plurality of different metallization layers; wherein
each metallization layer is formed at a different vertical distance above the substrate.
6. The memory device of claim 1 , wherein:
each storage element includes
a first electrode,
a second electrode, and
at least one memory layer programmable between at least two different impedance states in response to the application of electric fields between the first and second electrodes.
7. The memory device of claim 6 , wherein:
at least part of a programming of the at least one memory layer includes any selected from the group of:
an oxidation-reduction reaction, and
solid ion conduction.
8. The memory device of claim 1 , further including:
a plurality of bit lines, each bit line including
a first portion electrically connected to a corresponding group of bit line contacts and extending in the first direction, wherein
the first portion is formed of a metallization layer disposed above the gate structure and below the at least one plate structure.
9. The memory device of claim 8 , wherein each bit line further includes a second portion formed of the metallization layer and disposed in second direction different than the first direction.